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 Cadence SI / PI Analysis - Sigrity 

  • Power Integrity
  • Signal Integrity
  • Package Analysis
  • Products A-Z
 
Package Analysis
Cadence® package design and assessment tools, based on Sigrity™ technology, provide IC package design, analysis, and model extraction capability—and can exchange data with Cadence SiP Layout and Allegro® Package Designer. Assessment capabilities allow you to quickly spot potential signal and power integrity issues. Model extraction capabilities provide unique full package model extraction with accuracy into the multi-gigahertz frequency range.

Sigrity XtractIM
A fast IC package RLC extraction and assessment solution with an option to generate highly accurate broadband models. Supports a broad range of package types including BGA, SiP, and leadframe designs.
Learn more »
Sigrity PowerSI 3D EM Full-Wave Extraction Option
Full-wave solver for IC package and PCB capable of accurate analysis of complex 3D structures
Learn more »
 
Signal Integrity
Cadence® power-aware signal integrity (SI) tools, based on Sigrity™ technology, provide signoff-level accurate SI analysis for PCBs and IC packages. Signoff-level SI accuracy of signals with frequency higher than one gigahertz must consider the signals and the power/ground network that enables the current return path. Cadence Power-Aware SI tools interface seamlessly with Cadence Allegro® PCB and IC packaging physical design tools to create a complete power-aware design and SI analysis solution.

Sigrity PowerSI
An advanced signal integrity, power integrity, and design-stage EMI solution. Supports S-parameter model extraction and provides robust frequency domain simulation for entire IC package and PCB designs.
Learn more »
Sigrity SPEED2000
A complete PCB/package layout-based time domain EM simulation tool for signal integrity, power integrity, and design-stage EMI analysis. Supports advanced layout checking for design signoff and debug.
Learn more »
Sigrity SystemSI
A comprehensive and automated signal integrity environment for the accurate assessment of high-speed chip-to-chip system designs. Ensures robust parallel bus and serial link interface implementations.
Learn more »
Sigrity Broadband SPICE
A combination of S-parameter checking, tuning, and extraction capability to convert N-port network parameters to efficient SPICE-compatible circuits that can be used in time domain simulations.
Learn more »
Sigrity Transistor-to-behavioral Model Conversion (T2B)
Transistor-to-behavioral model conversion is an efficient way to create accurate models for SSO and other simulations. These models run an order of magnitude faster than the original transistor models.
Learn more »
Sigrity XcitePI-Extraction
Distributed model extraction of full-chip PDN and I/O nets for use in either chip-level or chip-package-board power integrity or power-aware signal integrity analysis.
Learn more »
 
Power Integrity
Cadence® power integrity (PI) solutions, based on Sigrity™ technology, provide signoff-level accuracy for AC and DC power analysis of PCBs and IC packages. Each tool seamlessly interfaces with Cadence Allegro® PCB and IC packaging physical design solutions.

Sigrity PowerSI
An advanced signal integrity, power integrity, and design-stage EMI solution. Supports S-parameter model extraction and provides robust frequency domain simulation for entire IC package and PCB designs.
Learn more »
Sigrity PowerDC
An efficient DC signoff solution for IC package and PCB designs, with electrical/thermal co-simulation to maximize accuracy. Quickly pinpoints IR drop and current hotspots. Automatically finds best remote sense locations.
Learn more »
Sigrity OptimizePI
A highly automated board and IC package AC frequency analysis solution. Supports pre-and post-layout decap studies, identifies impedance issues, and suggests placement locations for EMI decaps. Decap implementations are optimized for performance and cost.
Learn more »
 
Product A - Z
Allegro Sigrity Package Assessment and Extraction Option
Comprised of industry-leading Sigrity technologies, this option enables signal and PDN performance assessment, 2D and 3D analysis, electrical model extraction, and sign-off report generation for IC Packages.
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Allegro Sigrity Power-Aware SI Option
The Allegro Sigrity Power-Aware SI Option to the Allegro Sigrity SI Base provides a complete solution for the analysis of source synchronous parallel buses, such as DDR3 and DDR4. Comprised of industry-leading Sigrity technologies, this option enables extraction of combined signal and power delivery networks.
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Allegro Sigrity Serial Link Analysis Option
The Allegro Sigrity Serial Link Analysis Option to the Allegro Sigrity SI Base provides a complete solution for the analysis of multi-gigabit serial links.
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Allegro Sigrity SI Base
The Allegro Sigrity SI Base provides advanced interconnect modeling and SI simulation in support of constraint development and electrical analysis of high-speed designs. It simulates high-speed signals at the package, board, or multi-board level
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Sigrity Broadband SPICE
A combination of S-parameter checking, tuning, and extraction capability to convert N-port network parameters to efficient SPICE-compatible circuits that can be used in time domain simulations.
Learn more »
Sigrity OptimizePI
A highly automated board and IC package AC frequency analysis solution. Supports pre-and post-layout decap studies, identifies impedance issues, and suggests placement locations for EMI decaps. Decap implementations are optimized for performance and cost.
Learn more »
Sigrity PowerDC
An efficient DC signoff solution for IC package and PCB designs, with electrical/thermal co-simulation to maximize accuracy. Quickly pinpoints IR drop and current hotspots. Automatically finds best remote sense locations.
Learn more »
Sigrity PowerSI
An advanced signal integrity, power integrity, and design-stage EMI solution. Supports S-parameter model extraction and provides robust frequency domain simulation for entire IC package and PCB designs.
Learn more »
Sigrity PowerSI 3D EM Full-Wave Extraction Option
Full-wave solver for IC package and PCB capable of accurate analysis of complex 3D structures
Learn more »
Sigrity SPEED2000
A complete PCB/package layout-based time domain EM simulation tool for signal integrity, power integrity, and design-stage EMI analysis. Supports advanced layout checking for design signoff and debug.
Learn more »
Sigrity SystemSI
A comprehensive and automated signal integrity environment for the accurate assessment of high-speed chip-to-chip system designs. Ensures robust parallel bus and serial link interface implementations.
Learn more »
Sigrity Transistor-to-behavioral Model Conversion (T2B)
Transistor-to-behavioral model conversion is an efficient way to create accurate models for SSO and other simulations. These models run an order of magnitude faster than the original transistor models.
Learn more »
Sigrity XcitePI-Extraction
Distributed model extraction of full-chip PDN and I/O nets for use in either chip-level or chip-package-board power integrity or power-aware signal integrity analysis.
Learn more »
Sigrity XtractIM
A fast IC package RLC extraction and assessment solution with an option to generate highly accurate broadband models. Supports a broad range of package types including BGA, SiP, and leadframe designs.
Learn more »