Cadence IO-SSO Solution
The system engineer responsible for IO-SSO and the effects it has on the DDR memory system will be happy to know that all the technology needed for successful simulation is now available in a single suite of analysis tools, Cadence® IO-SSO Analysis Suite
Cadence IO-SSO Analysis Flow Design Flow
While the system designer is responsible for looking at the various topologies and analyzing the effects of simultaneous switching outputs, there are a number of interconnect models required to perform effective simulations. In addition, the simulations will be much faster if performed with power-aware SI models over transistor-level SPICE models. The IO-SSO Analysis Suite allows the designer to start with native design files for the I/O, chip, package, and PCB, and either convert or extract those models into a format that can be dropped into the SystemSI topology editor.
Once the models are in the system topology editor, the system designer goes through a process of connecting the models together. This includes the connections for signal, power, and ground. When the models are extracted using XcitePI, XtractIM, and PowerSI, model connection protocol (MCP) headers will appear in each model making the connectivity much more intuitive.
With the models connected in the topology editor, DDR simulation results can be acquired. With power-aware IBIS models and interconnect models with coupled signal, power, and ground, the simulation will include noise-causing ground bounce and power droop. With simultaneous switching outputs, noisy power and ground rails will actually change the waveforms of the signals. Only with this accurate simulation of signal, power, and ground can accurate prediction of simultaneous switching noise be accomplished.
With accurate waveform capture, SystemSI will carefully analyze the data and report back the compliance with DDR3, LPDDR3, and other popular memory interfaces. The report data is nicely captured in HTML format, and includes compliance criteria for waveform quality, eye quality, timing, and delay.
The IO-SSO Analysis Suite from Cadence provides an accurate and complete solution from a single EDA vendor. Given the design data for the chip, package, and PCB, a user of the IO-SSO Analysis Suite can extract all the fabrics into broadband interconnect models where signal, power, and ground are all coupled. In addition, transistor-level SPICE models can be converted to power-aware IBIS models. With the IO and interconnect models, DDR simulations can be run where the effects of simultaneous switching outputs are considered in the compliance criteria. Analysis data can be trusted as signoff quality as all the effects from non-ideal power and ground have been considered.