will be under system maintenance from Tuesday June 28, 6pm PT to Sunday July 3, 11pm PT. Login and registration will be disabled.
Home > Tools > Overview

 Cadence SI / PI Analysis - Sigrity 

Power and signal integrity issues—major challenges for today’s high-tech companies High-tech companies developing complex chips, packages, and boards grapple with power and signal integrity (SI) issues arising from rapid increases in IC speed and data transmission rates combined with decreases in power-supply voltages and denser, smaller geometries. At the same time, higher I/O counts, multiple stacked chips and packages, and greater electrical performance constraints are making the physical designs for IC packages more complex. To address these issues, you need advanced power integrity (PI) and power-aware SI tools. This level of technology allows you to see the complete picture and achieve signoff-level verification through your analysis.

Cadence Sigrity solution—SI and PI solutions for system-level verification and interface compliance. Signoff with confidence. Breakthrough Cadence® solutions, based on patented and proprietary Sigrity™ technologies, can help you overcome these challenges.

Cadence customers continue to be challenged with increasing data transmission rates and smaller chip, package, and PCB geometries. To address these concerns, Cadence acquired and integrated industry-leading power and signal integrity technology from Sigrity. The result is an enhanced front-to-back constraint-driven implementation and analysis solution that begins with an early “what if” investigation and flows through final signoff.

The Cadence Sigrity solutions target complete power-delivery system analyses across chips, packages, and boards; system-level SI analysis, including simultaneous switching noise (SSN) analysis of high-speed signal transmissions; and, advanced physical design for single- and multi-chip packages, state-of-the-art 3D packages, and systems in packages (SiP).

Allegro Sigrity: Great Alone, Better Together Sigrity’s SI / PI analysis technology can be used to analyze design data from all popular PCB and IC package design tools. The Sigrity technology can be acquired as standalone point tools as well as an Allegro® Sigrity base + options configuration that features seamless integration between design and analysis technology.

Advanced extraction and analysis technology suitable for analysis experts is available in an environment where changes to the physical design can be made and saved in the same design format created by design layout engineers. While layout engineers may not have all the expertise required to run advanced analysis tools, sharing the same environment used by analysis experts will allow them to run first-order analysis and help make decisions during the design process.

For final verification, the expert can call on the advanced options and confirm a design is ready for tapeout or, if necessary, experiment with design changes to optimize performance.
What you can perform by adopting Sigrity solutions:
  • Analyze the complete power delivery system across chips, packages, and boards.
  • Perform system-level SI analysis, including simultaneous switching noise analysis of high-speed signal transmissions.
  • Utilize the advanced physical design tools for single and multi-chip packages, state-of-the-art 3D packages, and SiPs.
Allegro Sigrity SI Solution (Base + Options) Sigrity PI Solution (Suite)