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Cadence SiP Co-Design 


Optimize the chip-package interface

Cadence SiP Co-Design technology provides true integration with IC design in a physical co-design environment to help engineers make strategic tradeoffs earlier and with greater confidence.

Cadence Co-Design Datasheet »
1 resources found
 
Title Type Rated
Cadence Chip-Package-Board Co-Design Solution Datasheet
Format: .PDF (1.8MB)    Date: 12 Aug 2011
Datasheet
 1
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