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Home > Tools > IC Packaging and Co-Design > Allegro Package Designer

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Allegro Package Designer 


Complete package implementation capabilities

Allegro Package Designer provides true integration with IC development in a physical co-design environment to help engineers make strategic tradeoffs earlier and with greater confidence.

Allegro Package Designer Datasheet »

Product Image
Cadence® Allegro® Package Designer enables constraint driven substrate interconnect design, extraction, modeling, and signal integrity analysis. The final design output provides automatic system-level handoffs for PCB design.

Features/Benefits
  • Supports a full front-to-back physical implementation flow for IC Package design
  • Determines the best package and substrate options early in the IC design cycle
  • Provides comprehensive design rule- and electrical constraint–driven layout
  • Incorporates design for manufacturing (DFM) methodologies
  • Improves design flow with intrinsic support for all industry standards
  • Models entire design with Cadence 3D Design Viewer