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This is the third in a series of discussions we would like to open up regarding "favorite features" in an IC Packaging implementation design tool. As the industry continues to include larger numbers of larger die in a smaller IC package, the...( read more ) ... Read more » Is there anyone who does not carry a mobile communication device anymore? Sending and receiving phone calls seem to be just a minor feature on these devices nowadays. With texting, email, Wi-Fi, GPS, camera, video, image recognition software, and many...( read more ) ... Read more » This is the second in a series of discussions we would like to open up regarding “favorite features” in an IC Packaging implementation design tool. Recently on a visit to an avid user of IC Package design tools, we heard the requirement mantra...( read more ) ... Read more »
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