Home > Tools > IC Packaging and Co-Design > Customer Success


* Required Fields

Recipients email * (separate multiple addresses with commas)

Your name *

Your email *

Message *

Contact Us

* Required Fields
First Name *

Last Name *

Email *

Company / Institution *

Company Location *

Comments: *

IC Packaging and Co-Design 

Bayside Design Inc
Design Challenge
Develop a complete evaluation system for 6.5-Gbps SerDes design, including package, board, FPGA, and software for debug
Complete project in eight weeks

Cadence Solution
Upgraded design environment with Cadence Allegro® system interconnect design platform
 Read Full story »

Design Challenges
Accelerate the design process with automated, placement-aware pin assignment
Optimize the physical connectivity, even as it changes
Ensure quality and reduce complexity with reuse of interface rules and protocols

Cadence Solution
Allegro FPGA System Planner XL
 Read Full story»

Faraday Technology
Business Challenge
  • Produce prototype of highly complex, 300-million-gate SoC—the 1st such effort in Taiwan—in 7 months
  • Grow business through ability to develop large-scale chip designs
Design Challenges
  • Shorten verification and analyses processes
  • Process large database for huge SoC design
  • Manage and integrate different technologies across industries
Cadence Solutions
  • First Encounter® Design Exploration and Prototyping
  • Encounter® Digital Implementation System
  • Encounter Conformal® Equivalence Checker
  • Incisive® verification platform
  • Sigrity™ packaging and PCB signal and power analysis solutions
  • Verification IP Catalog
  • Completed complex design from data-in to tapeout within 7 months
  • Reduced one iteration for timing optimization, extraction, analysis and verification of physical design down to 4 days
  • Expanded design capacity by 10X
 Read full story»

Hyundai MOBIS
Imran Shaik
Hyundai MOBIS

Automotive parts manufacturer Hyundai MOBIS was facing electromagnetic interference (EMI) problems with its PCB designs. In this short video clip, Imran Shaik, a project lead on EMI simulations, discusses how Cadence® Sigrity™ PowerSI™ and Cadence Sigrity SPEED2000™ helped the company reduce its PCB testing time and get its products to market faster.

Open-Silicon, Inc.
Kavitha Nagarajan
Open-Silicon, Inc.

Kavitha Nagarajan, Lead Engineer – IC Package Design at Open-Silicon, Inc., describes how the company leveraged the Cadence Integrated SPB environment to successfully complete a complex project with a tight deadline.