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PCB Design 

Press Releases
Fujitsu Adopts Cadence Chip Planning Technology
Cadence Develops Die Model Enabling Comprehensive Chip-Package Co-Design Solution with Fujitsu
Cadence Teams with AcAe to Accelerate Customer Transitions to Allegro PCB Products

Articles
IPC-2581 Consortium Validates Bare Board Fab Data
Common Ground: Seeking Pin Assignment Balance in FPGA-Based Boards
Heard at DAC: the Question on Everyone’s Mind