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Tempus Timing Signoff Solution 


Massively parallelized timing analysis and physically aware multi-mode, multi-corner optimization for faster design closure and signoff

Cadence® Tempus™ Timing Signoff Solution is a complete standalone tool that delivers silicon-accurate timing signoff and signal integrity analysis that ensures operational chips after tapeout. By tightly coupling the design implementation environment with the timing signoff environment, the Tempus solution enhances timing convergence throughout the design flow and greatly reduces the time to design closure.
31 resources found
 
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Cadence QuickView Layout and Manufacturing Data Viewer Datasheet
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Quantus QRC Extraction Solution Datasheet
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How to Speed Signoff Extraction by 5X with Next-Generation Extraction Tool White Paper
Format: .PDF    Date: 14 Jul 2014
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Hierarchical Timing Analysis: Pros, Cons, and a New Approach White Paper
Format: .PDF    Date: 11 Apr 2014
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Solutions for Mixed-Signal SoC Verification Using Real Number Models White Paper
Format: .PDF (1.8MB)    Date: 19 Nov 2013
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How to Achieve 10X Faster Power Integrity Analysis and Signoff White Paper
Format: .PDF (1.2MB)    Date: 12 Nov 2013
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 2
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A Call to Action: How 20nm Will Change IC design White Paper
Format: .PDF (1.3MB)    Date: 08 Feb 2013
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 5
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Taming the Challenges of 20nm Custom/Analog Design White Paper
Format: .PDF (1.4MB)    Date: 09 Nov 2012
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Interactive Short Locator: Establishing Efficiency and Predictability in the LVS Short Debug Process for Advanced SoC Designs Technical Paper
Format: .PDF (1.5MB)    Date: 30 Jan 2012
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 1
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Modeling Stress-Induced Variability Optimizes IC Timing Performance White Paper
Format: .PDF    Date: 08 Dec 2011
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Cadence DFM services Datasheet
Format: .PDF (1.5MB)    Date: 11 Oct 2011
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Cadence Litho Electrical Analyzer Datasheet
Format: .PDF    Date: 01 Apr 2008
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Model-Based Verification and Analysis for 65/45nm Physical Design
Format: .PDF (1.5MB)    Date: 27 Feb 2008
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