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Digital Implementation
Optimizing logical, physical, electrical, and manufacturing effects
Cadence digital implementation technology eliminates iteration without sacrificing design quality by addressing timing sensitivity, yield variation, and leakage power from the start.
Design planning
To create a design layout that fulfills the often conflicting objectives of performance, power, and cost, engineers must perform comprehensive physical design space exploration and feasibility analysis up-front. Cadence® technology allows designers to implement a silicon virtual prototyping methodology to perform the planning and analysis that ensures a smooth hand-off to the physical implementation flow. It also includes the latest low-power design and yield enhancement capabilities to support advanced node designs.
First Encounter Design Exploration and Prototyping
Enables quick full-chip virtual prototyping to accurately capture downstream physical/electrical impacts at the beginning of the design cycle while making hierarchical implementation easier and faster for large-scale, high-speed designs.
Learn more
»
Encounter Digital Implementation System
Delivers a complete solution for giga-gate/GHz, low power, and mixed-signal designs at advanced and mainstream process nodes in a single, scalable multi-CPU-enabled design environment.
Learn more
»
Hierarchical design
Achieving rapid design convergence in large, complex chips requires greater capacity, accuracy, and automation than that provided by conventionally rigid hierarchical design flows. With innovative and flexible Cadence
®
technology, designers can eliminate iterations and achieve timing closure quickly. They can also leverage advanced interface logic modeling, multi-mode/multi-corner design, and virtual partitioning to increase both productivity and accuracy.
First Encounter Design Exploration and Prototyping
Enables quick full-chip virtual prototyping to accurately capture downstream physical/electrical impacts at the beginning of the design cycle while making hierarchical implementation easier and faster for large-scale, high-speed designs.
Learn more
»
Encounter Digital Implementation System
Delivers a complete solution for giga-gate/GHz, low power, and mixed-signal designs at advanced and mainstream process nodes in a single, scalable multi-CPU-enabled design environment.
Learn more
»
NanoRoute Advanced Digital Router
Ensures routing convergence on timing, area, power, signal integrity, and manufacturability constraints while maintaining the utmost in speed and capacity to support giga-gate/gigahertz and advanced node design.
Learn more
»
Block implementation
The Encounter Digital Implementation System block-closure flow offers a seamless continuation from the design exploration stage. Providing functionality from placement to clock tree synthesis and signal integrity closure for multi-mode/multi-corner designs, it ensures design convergence to get your design from a virtual prototype to a signoff-ready GDSII database. The block-closure flow is powered by the latest power, performance, and area optimization algorithms, including the new advanced analysis engine for concurrent SI and timing closure—all running on a multi-CPU backplane—to provide the best quality of results and turnaround time for giga-gate/GHz designs.
First Encounter Design Exploration and Prototyping
Enables quick full-chip virtual prototyping to accurately capture downstream physical/electrical impacts at the beginning of the design cycle while making hierarchical implementation easier and faster for large-scale, high-speed designs.
Learn more
»
Encounter Digital Implementation System
Delivers a complete solution for giga-gate/GHz, low power, and mixed-signal designs at advanced and mainstream process nodes in a single, scalable multi-CPU-enabled design environment.
Learn more
»
NanoRoute Advanced Digital Router
Ensures routing convergence on timing, area, power, signal integrity, and manufacturability constraints while maintaining the utmost in speed and capacity to support giga-gate/gigahertz and advanced node design.
Learn more
»
Low-power implementation
Encounter Digital Implementation System is an integral part of the holistic Cadence Low-Power Solution. Because it leverages the same pervasive Common Power Format (CPF) design intent used throughout the Low-Power Solution, you benefit from fully automated, correct-by-construction low-power implementation that can turn your advanced power-efficient design into reality. Encounter Digital Implementation System supports all major low-power design techniques such as shutoff (PSO), multiple supply voltages (MSV), dynamic voltage and frequency scaling (DVFS), substrate biasing, and more.
First Encounter Design Exploration and Prototyping
Enables quick full-chip virtual prototyping to accurately capture downstream physical/electrical impacts at the beginning of the design cycle while making hierarchical implementation easier and faster for large-scale, high-speed designs.
Learn more
»
Encounter Digital Implementation System
Delivers a complete solution for giga-gate/GHz, low power, and mixed-signal designs at advanced and mainstream process nodes in a single, scalable multi-CPU-enabled design environment.
Learn more
»
Encounter Timing System
Serves both front-end logic designers looking for high-quality static timing analysis and ease of use, as well as back-end implementation engineers requiring silicon-accurate electrical analysis for signoff and a common timing engine for faster convergence.
Learn more
»
Encounter Power System
Provides consistent and convergent power and power rail integrity analysis and optimization across the design and implementation flow, from power planning through signoff. Front-end logic designers benefit from high-quality, early power and rail analysis with ease of use, while back-end physical designers are assured of comprehensive signoff analysis and silicon correlation.
Learn more
»
Advanced node design
Faster design convergence at 65nm down to 28nm requires fully integrated and comprehensive DFM and DFY solution, from RTL to GDSII. Encounter Digital Implementation System’s advanced node design technology prevents and corrects potential and harmful litho effects, random defects, on-chip variation, and variation due to chemical-mechanical polishing. Using rule- and model-based in-design analysis (pre-qualified and closely correlated with foundry process simulation), it guides design implementation while quickly identifying hotspots—minimizing risk up front and preventing unexpected design re-spins and late-stage iterations. This “correct-by-construction” approach to advanced node design ensures faster turnaround time in meeting performance, power, and reliability targets while yielding high-quality results in silicon.
Encounter Digital Implementation System
Delivers a complete solution for giga-gate/GHz, low power, and mixed-signal designs at advanced and mainstream process nodes in a single, scalable multi-CPU-enabled design environment.
Learn more
»
NanoRoute Advanced Digital Router
Ensures routing convergence on timing, area, power, signal integrity, and manufacturability constraints while maintaining the utmost in speed and capacity to support giga-gate/gigahertz and advanced node design.
Learn more
»
Encounter Timing System
Serves both front-end logic designers looking for high-quality static timing analysis and ease of use, as well as back-end implementation engineers requiring silicon-accurate electrical analysis for signoff and a common timing engine for faster convergence.
Learn more
»
Mixed-signal design
Physical implementation of mixed-signal designs is a growing challenge. As more analog functionality and larger blocks of digital logic are integrated into the same die, design teams require practical and efficient implementation methodologies that maintain design intent and database coherence between analog and digital domains, from floorplanning through physical assembly.
Cadence® mixed-signal implementation technology offers a combination of advanced tools and methodologies that leverage unified design and verification intent and unique design abstraction, resulting in faster convergence. With features such as bi-directional management of physical and electrical constraints, common power intent specification, advanced modeling, integrated signoff analysis, and pre- and post-mask ECO, Cadence technology brings more automation, efficiency, and predictability to mixed-signal design implementation.
Encounter Digital Implementation System
Delivers a complete solution for giga-gate/GHz, low power, and mixed-signal designs at advanced and mainstream process nodes in a single, scalable multi-CPU-enabled design environment.
Learn more
»
Virtuoso Digital Implementation
Provides a complete synthesis/place-and-route system for small digital block implementation in the context of a schematic-driven, mixed-signal design methodology.
Learn more
»
3D-IC design
3D-ICs with through-silicon via (TSV) pack a great deal of functionality into small form factors, while improving performance and reducing costs. 3D-IC packages also accommodate multiple heterogeneous die, such as logic, memory, analog, RF, and micro-electrical mechanical systems (MEMS). And since 3D-ICs support various process nodes, such as 28nm for high-speed logic and 130nm for analog, developers have the flexibility to place in a single package all of the functionality they want without requiring an expensive move to a new process node.
Cadence® stacked-die technology offers an automated 3D-IC/TSV design methodology integrated with implementation, extraction, and analysis tools. It captures design intent upfront, so users can pass design intent seamlessly throughout the flow. It then abstracts physical information to help users optimize 3D floorplanning and placement across multiple heterogeneous die, IC package, and board. Tight links to Cadence
custom IC
and
system-in-package
(SiP) design environments to allow for continuous convergence, ensuring a manufacturable packaging solution. Robust thermal analysis and power management capabilities support design closure; TSVs and the ability to implement silicon interposers support both intermediate and long-term design needs.
Encounter Digital Implementation System
Delivers a complete solution for giga-gate/GHz, low power, and mixed-signal designs at advanced and mainstream process nodes in a single, scalable multi-CPU-enabled design environment.
Learn more
»
Design closure
The complexity and scale of today's digital designs have created new challenges in design exploration and timing closure for different modes and corners, and also in overall runtime and performance. Encounter Digital Implementation System’s design closure technology is a fully integrated part of the Cadence digital end-to-end flow. It offers a full set of physical implementation technologies, from design exploration to implementation and signoff of both flat and hierarchical designs, powered by an end-to-end multi-CPU backplane. In a single environment, you can achieve the best power, performance, and area results for your giga-gate/GHz, low-power, and mixed-signal designs using either mainstream or advanced process technology nodes.
Encounter Digital Implementation System
Delivers a complete solution for giga-gate/GHz, low power, and mixed-signal designs at advanced and mainstream process nodes in a single, scalable multi-CPU-enabled design environment.
Learn more
»
Signoff analysis
Successful digital chip design hinges on accurate and consistent signoff analysis. With Cadence® signoff analysis technology, you can perform all of your electrical verification tasks in an integrated, easy-to-use environment. This includes front-end to back-end design handoff, signoff-driven implementation, and final signoff convergence. Cadence technology analyzes timing with variation and noise, power consumption, IR drop, electromigration, and thermal characteristics with high precision, and it leverages electrical abstraction models and a scalable multi-CPU infrastructure to accelerate signoff for large designs. And with our multi-dimensional root-cause analysis capability, you can shave weeks off of tapeout schedules and prevent silicon failures to further improve your productivity and profitability.
Cadence Physical Verification System
Offers a front-to-back design, implementation, and signoff flow in a single solution. Speeds turnaround of design rule check and layout versus schematic verification.
Learn more
»
Encounter Timing System
Serves both front-end logic designers looking for high-quality static timing analysis and ease of use, as well as back-end implementation engineers requiring silicon-accurate electrical analysis for signoff and a common timing engine for faster convergence.
Learn more
»
Encounter Power System
Provides consistent and convergent power and power rail integrity analysis and optimization across the design and implementation flow, from power planning through signoff. Front-end logic designers benefit from high-quality, early power and rail analysis with ease of use, while back-end physical designers are assured of comprehensive signoff analysis and silicon correlation.
Learn more
»
Encounter Library Characterizer
Automatically generates the latest library modeling formats. Accelerates characterization and re-characterization.
Learn more
»
Manufacturability signoff
At today’s advanced nodes, digital implementation software must account for challenges of smaller transistors and wires, as well as the data capacity and complexity challenges of denser and more complex chips. Cadence® solutions for manufacturability take the knowledge of creating the mask and how the chip is going to be manufactured and bring it back into the design phase. This helps designers compensate for physical effects at nanometer geometries while providing a reliable way to achieve manufacturing signoff before tapeout.
Assura Physical Verification
Performs design rule checking and layout vs. schematic verification to deliver high-yielding custom IP for SoC designs.
Learn more
»
Cadence Physical Verification System
Offers a front-to-back design, implementation, and signoff flow in a single solution. Speeds turnaround of design rule check and layout versus schematic verification.
Learn more
»
Cadence Chip Optimizer
Uses a 3D space-based approach that models, analyzes, and optimizes layout based on electrical constraints, manufacturing rules, and objectives.
Learn more
»
Cadence Litho Physical Analyzer
Detects and corrects lithography hotspots. Uses a model-based technology to predict silicon contours quickly and accurately. Improves parametric yield and chip performance.
Learn more
»
Cadence Litho Electrical Analyzer
Extracts device and interconnect electrical behavior from contours. Detects and repairs timing and leakage hotspots due to systematic variations.
Learn more
»
Cadence CMP Predictor
Optimizes design performance through model-based intelligent metal fill and hotspot detection and correction.
Learn more
»
Assura Physical Verification
Performs design rule checking and layout vs. schematic verification to deliver high-yielding custom IP for SoC designs.
Learn more
»
Cadence Chip Optimizer
Uses a 3D space-based approach that models, analyzes, and optimizes layout based on electrical constraints, manufacturing rules, and objectives.
Learn more
»
Cadence CMP Predictor
Optimizes design performance through model-based intelligent metal fill and hotspot detection and correction.
Learn more
»
Cadence Litho Electrical Analyzer
Extracts device and interconnect electrical behavior from contours. Detects and repairs timing and leakage hotspots due to systematic variations.
Learn more
»
Cadence Litho Physical Analyzer
Detects and corrects lithography hotspots. Uses a model-based technology to predict silicon contours quickly and accurately. Improves parametric yield and chip performance.
Learn more
»
Cadence Low-Power Methodology Kit
Streamlines the adoption of low-power techniques and optimizes their usage. Eliminates risk with a complete front-to-back methodology, best practices, checklists, and reference flows.
Learn more
»
Cadence Physical Verification System
Offers a front-to-back design, implementation, and signoff flow in a single solution. Speeds turnaround of design rule check and layout versus schematic verification.
Learn more
»
Cadence QRC Extraction
Extracts and analyzes full-chip parasitics quickly and accurately. Accelerates timing closure and delivers higher quality of silicon.
Learn more
»
Encounter Digital Implementation System
Delivers a complete solution for giga-gate/GHz, low power, and mixed-signal designs at advanced and mainstream process nodes in a single, scalable multi-CPU-enabled design environment.
Learn more
»
Encounter Library Characterizer
Automatically generates the latest library modeling formats. Accelerates characterization and re-characterization.
Learn more
»
Encounter Power System
Provides consistent and convergent power and power rail integrity analysis and optimization across the design and implementation flow, from power planning through signoff. Front-end logic designers benefit from high-quality, early power and rail analysis with ease of use, while back-end physical designers are assured of comprehensive signoff analysis and silicon correlation.
Learn more
»
Encounter Timing System
Serves both front-end logic designers looking for high-quality static timing analysis and ease of use, as well as back-end implementation engineers requiring silicon-accurate electrical analysis for signoff and a common timing engine for faster convergence.
Learn more
»
First Encounter Design Exploration and Prototyping
Enables quick full-chip virtual prototyping to accurately capture downstream physical/electrical impacts at the beginning of the design cycle while making hierarchical implementation easier and faster for large-scale, high-speed designs.
Learn more
»
NanoRoute Advanced Digital Router
Ensures routing convergence on timing, area, power, signal integrity, and manufacturability constraints while maintaining the utmost in speed and capacity to support giga-gate/gigahertz and advanced node design.
Learn more
»
SoC Encounter RTL-to-GDSII System
Combines RTL synthesis, silicon virtual prototyping, automated floorplan synthesis, clock network synthesis, design for manufacturability and yield, low-power and mixed-signal design support, and nanometer routing. Allows engineers to synthesize to a flat virtual prototype implementation at the beginning of the design cycle.
Learn more
»
Virtuoso Digital Implementation
Provides a complete synthesis/place-and-route system for small digital block implementation in the context of a schematic-driven, mixed-signal design methodology.
Learn more
»
VoltageStorm Power Verification
Automates the analysis and optimization of de-coupling capacitance size and location. Reduces dynamic IR drop.
Learn more
»
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