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EDA(Electronics Design Automation)분야의 세계 최대 마켓리더인 케이던스(Cadence Design Systems Inc.)는 전세계 반도체, 통신장비, 멀티미디어 및 가전제품 회사들이 다양한 제품을 적기에 개발하고 생산할 수 있도록 EDA 소프트웨어와 디자인 서비스를 제공하고 있습니다. 미국 캘리포니아주 산호세에 본사를 두고 있으며, 세계 주요지역에 현지법인, 연구소, 디자인센터를 두고 있습니다. 회사소개(About Cadence Korea).



Cadence News

2014 | 2013 | 2012 | 2011 | 2010 | 2009

December
17 Dec 2014: Fujitsu Kansai-Chubu Net-Tech Shortens Design Time by 40 Percent on 100G Transport System with Cadence High-Level Synthesis Solution17 Dec 2014: GLOBALFOUNDRIES and Cadence Deliver First SoC Enablement Solution Featuring ARM Cortex-A17 Processor in 28nm-SLP Process11 Dec 2014: Cadence Perspec System Verifier Delivers Up to 10X Productivity Improvement in System-on-Chip Verification11 Dec 2014: Cadence Receives Commendation from City of San José10 Dec 2014: Media Alert: Cadence to Showcase Audio and Video IP at CES 201503 Dec 2014: Media Alert: Cadence to Host Front-End Design Summit02 Dec 2014: Cadence Senior Group Director Investor Relations Alan Lindstrom to Present at the Bernstein Technology Innovation Summit01 Dec 2014: HiSilicon Expands Adoption of Cadence Tools and IP for Advanced-Node FinFET Designs
November
21 Nov 2014: Cadence President and Chief Executive Officer Lip-Bu Tan to Present at the Credit Suisse Technology Conference12 Nov 2014: Cadence Design Systems Professorship Endowed at Stanford University10 Nov 2014: Sonics Adopts Cadence JasperGold Apps Formal Verification for On-Chip Network IP Development03 Nov 2014: Media Alert: Cadence to Host Low-Power Technology Summit
October
30 Oct 2014: Media Alert: Cadence to Host Jasper User Group Conference 201428 Oct 2014: Cadence Senior Vice President and Chief Financial Officer Geoff Ribar to Present at the RBC Technology, Internet, Media & Telecommunications Conference27 Oct 2014: Cadence Announces Industry’s First 25G Ethernet Verification IP27 Oct 2014: Cadence Announces Virtuoso Liberate AMS, Industry’s First Dynamic Simulation Characterization Solution for Mixed-Signal Designs23 Oct 2014: Cadence Announces Broad Portfolio of 3D Memory Verification IP22 Oct 2014: Cadence Introduces Automotive Functional Safety Verification Solution, Reducing ISO 26262 Compliance Preparation Effort by up to 50 Percent22 Oct 2014: Müller-BBM Active Noise Control and Sound Design Now Optimized on Cadence Tensilica HiFi Audio/Voice Processors for Automotive Applications20 Oct 2014: Global Unichip Corporation Uses Cadence Encounter Digital Implementation System to Complete Its First Production Design on TSMC 16FF+ Process20 Oct 2014: Media Alert: Cadence to Host Mixed-Signal Technology Summit20 Oct 2014: Cadence Reports Third Quarter 2014 Financial Results16 Oct 2014: Media Alert: Cadence to Showcase Automotive Application Solutions at SAE 2014 Convergence Conference and Exhibition16 Oct 2014: Media Alert: Cadence to Showcase Latest Automotive Technologies at the 2014 IEEE-SA Ethernet & IP @ Automotive Technology Day15 Oct 2014: Media Alert: Cadence Distinguished Engineer Grant Martin to Present at Linley Tech Processor Conference15 Oct 2014: Cadence Announces Industry’s First Multi-Protocol DDR4 and LPDDR4 IP Solution09 Oct 2014: Cadence Offers Industry’s First MIPI SoundWire Controller IP Solution 09 Oct 2014: Cadence Wins Two TSMC Partner of the Year Awards for Soft IP and 16FF+ Solutions08 Oct 2014: Media Alert: Cadence to Keynote and Sponsor MemCon 201407 Oct 2014: Cadence Announces Pricing of $350 Million Senior Notes Offering03 Oct 2014: Cadence Announces Third Quarter 2014 Financial Results Webcast02 Oct 2014: Media Alert: Cadence to Showcase Advanced Verification Solutions at DVCon Europe 201401 Oct 2014: ARM Achieves 50X Faster OS Boot-Up on Mali GPU Development using Cadence Palladium XP Platform with ARM Fast Models
September
30 Sep 2014: Media Alert: Cadence to Showcase ARM-Optimized Solutions at ARM TechCon 201430 Sep 2014: ARM and Cadence Expand Collaboration for IoT and Wearable Device Applications Targeting TSMC’s Ultra-Low Power Technology Platform29 Sep 2014: Cadence IP Portfolio and Tools to Support New TSMC Ultra-Low Power Technology Platform29 Sep 2014: Cadence and ARM Expand System-on-Chip Design Collaboration with New Multi-Year Technology Access Agreement26 Sep 2014: Cadence Digital and Custom/Analog Tools Achieve TSMC Certification for 16FF+ Process, Companies Collaborate on 10nm FinFET26 Sep 2014: Cadence Unveils Broad IP Portfolio for New TSMC 16nm FinFET Plus Process25 Sep 2014: Media Alert: Cadence to Demonstrate 16FF+ Design Solutions at TSMC 2014 OIP Ecosystem Forum05 Sep 2014: Media Alert: Cadence to Showcase Latest System Connectivity and Analysis Technologies at PCB West 201403 Sep 2014: TSMC Adopts Cadence Solutions for 16nm FinFET Library Characterization02 Sep 2014: SPL Vitalizer In-Car Audio Software Now Available on Cadence Tensilica HiFi Audio/Voice DSP Family
August
04 Aug 2014: Cadence Introduces Voltus-Fi Custom Power Integrity Solution, Delivering Foundry-Certified SPICE-Level Accuracy for Transistor-Level Power Signoff
July
31 Jul 2014: Cadence Senior Vice President and Chief Financial Officer Geoff Ribar to Present at the Pacific Crest Global Technology Leadership Forum30 Jul 2014: Airoha Technology Adopts Cadence RTL Synthesis and Test Solution, Reducing Power Consumption by 15 Percent29 Jul 2014: Cadence Achieves PCIe 3.0 Compliance for PHY and Controller IP28 Jul 2014: MEDIA ALERT: Cadence to Deliver Keynote Speech and Showcase IP Technology at 2014 Flash Memory Summit24 Jul 2014: Renesas Achieves 3X Reduction in Chip-Finishing Turnaround Time Using Cadence QuickView Signoff Data Analysis Environment23 Jul 2014: Cadence Introduces Three New OrCAD PCB Products Targeting Emerging Electronic Product Design Challenges21 Jul 2014: Cadence Reports Second Quarter 2014 Financial Results17 Jul 2014: Cadence Announces Protium Rapid Prototyping Platform and Expands System Development Suite Low-Power Verification15 Jul 2014: Ricoh Cuts Parasitic Extraction Design Closure Time in Half Using Cadence Quantus QRC Extraction Solution14 Jul 2014: Cadence Announces Next-Generation Quantus QRC Extraction Solution, Delivering Best-in-Class Performance and Accuracy14 Jul 2014: Cadence Quantus QRC Extraction Solution Certified for TSMC 16nm FinFET07 Jul 2014: Hitachi Tapes Out 28nm Design with Cadence Tempus Timing Signoff Solution, Reducing Timing Closure by One Month07 Jul 2014: Cadence Announces Second Quarter 2014 Financial Results Webcast
June
30 Jun 2014: MegaChips Adopts Cadence RTL-to-Signoff Solution, Cuts Tapeout Schedule in Half24 Jun 2014: LTE Protocol Stack from NextG-Com Now Available on Cadence Tensilica Processor23 Jun 2014: Cadence and QNX Announce New Tensilica HiFi Audio/Voice DSP Application for In-Car Active Noise Control20 Jun 2014: Media Alert: Chris Rowen to Present at Beyond Fusion Conference16 Jun 2014: Cadence Completes Acquisition of Jasper Design Automation03 Jun 2014: Cadence and Intel Collaborate to Enable a 14nm Tri-gate Design Platform for Customers of Intel Custom Foundry02 Jun 2014: Cadence Virtuoso Layout Suite for Electrically Aware Design Adopted By ON Semiconductor
May
29 May 2014: MEDIA ALERT: Cadence Showcases the Latest Innovations at DAC 201427 May 2014: Cadence Offers Production Proven USB 3.0 Host Controller IP27 May 2014: Media Alert: Cadence to Showcase Comprehensive PCI Express IP and Verification Solutions at PCI-SIG 201421 May 2014: Media Alert: Chris Rowen to Present at Embedded Vision Summit West 201421 May 2014: Cadence Announces New Integrated Solution for Rapid Die-Package Interconnect Planning20 May 2014: CSR Selects Cadence Palladium XP Platform for Development of ARM-based Automotive Infotainment Systems20 May 2014: Cadence and ARM Expand Collaboration for 64-bit Processor Designs20 May 2014: Cadence Extends Spectre XPS to Support Mixed-Signal Designs19 May 2014: Media Alert: Cadence to Showcase RF Solutions at the International Microwave Symposium 201419 May 2014: Cadence Offers Immediate Availability of DDR4 PHY IP on TSMC 16nm FinFET Process15 May 2014: Cadence Announces Availability of IP Solutions on 28nm FD-SOI Process15 May 2014: Cadence Announces Immediate Availability of Industry’s First Verification IP for PCI Express 4.0 Technology12 May 2014: HiSilicon Expands Cadence Palladium XP Platform Usage For Mobile and Digital Media SoC and ASIC Development06 May 2014: Cadence Senior Vice President and Chief Financial Officer Geoff Ribar to Present at the JPMorgan Technology, Media and Telecom Conference06 May 2014: Media Alert: Connect, Share, and Inspire at CDNLive EMEA 2014 - Cadence User Conference
April
30 Apr 2014: Sonic Emotion Absolute 3D Sound Software Now Available on Cadence Tensilica HiFi Low-Power Audio/Voice Processors29 Apr 2014: Cadence Corporate Vice President and Controller Sean Sobers to Present at the Wedbush Transformational Technologies Conference24 Apr 2014: Cadence Corporate Vice President – Finance James Haddad to Present at the Jefferies Technology, Media & Telecom Conference21 Apr 2014: Media Alert: Chris Rowen to Present at Linley Tech Processor Conference21 Apr 2014: ARM Implements the Cadence Library Characterization Solution for Advanced Node Foundation IP Development21 Apr 2014: Cadence to Expand Verification Solution with Acquisition of Jasper Design Automation21 Apr 2014: Cadence Reports First Quarter 2014 Financial Results15 Apr 2014: Cadence Digital and Custom/Analog Tools Achieve TSMC V1.0 DRM Certification for 16nm FinFET Process14 Apr 2014: Spreadtrum Adopts Cadence Palladium XP II Platform for Mobile SoC and Hardware-Software Verification14 Apr 2014: Media Alert: Martin Lund to Keynote at EDPS Conference04 Apr 2014: Cadence Announces First Quarter 2014 Financial Results Webcast
March
18 Mar 2014: Yamaha Reduces Leakage Power by 50 Percent in Mobile Chip Using Cadence Low-Power Solution17 Mar 2014: Cadence Incisive Specman Elite Testbench Reduces Verification Time for Sharp by 50 Percent12 Mar 2014: Cadence and GLOBALFOUNDRIES Announce First Test Chip Featuring ARM Cortex-A12 Processor in 28nm-SLP Process12 Mar 2014: Mikron Licenses Cadence Physical Verification System and QRC Extraction Solutions for 90 nm IC Design Flow11 Mar 2014: Cadence Physical Verification System Certified for GLOBALFOUNDRIES 65nm to 14nm FinFET Processes11 Mar 2014: Cadence Expands ARM-based System Verification Solution, Reducing Time-to-Market for Mobile, Networking and Server Applications05 Mar 2014: Cadence Announces New Allegro TimingVision Environment to Speed Timing Closure of High-Speed PCB Interfaces by up to 67%03 Mar 2014: Cadence Rolls Out 2014 CDNLive User Conferences
Feburary
26 Feb 2014: Cadence Licenses Tensilica ConnX BBE16 DSP to GCT Semiconductor26 Feb 2014: Cadence Group Director of Investor Relations Alan Lindstrom to Present at the Piper Jaffray Technology, Media & Telecom Conference25 Feb 2014: Global Navigation Satellite Receiver From Galileo Satellite Navigation Now Available on Cadence Tensilica ConnX DSP IP Cores24 Feb 2014: Cadence Redefines Verification Planning and Management with Incisive vManager Solution20 Feb 2014: Cadence Announces New Tensilica Imaging and Video Processor for Increasingly Complex Signal Processing Functions19 Feb 2014: Cadence Launches Next-Generation Tensilica High-Performance ConnX Baseband DSP Family19 Feb 2014: Rubidium Speech Processing Solutions Now Available for Cadence Tensilica HiFi Audio/Voice DSPs19 Feb 2014: Cadence and Sensory Reduce Voice Activation Power Dissipation in Mobile Devices to Less than 17 MicroWatts18 Feb 2014: Cadence Announces Sensor Platforms as New Tensilica HiFi Audio Partner for Sensor Fusion and Context Awareness Applications18 Feb 2014: Movea SmartMotion Technology Now Available on Cadence Tensilica HiFi Audio/Voice DSP Family18 Feb 2014: Cadence Completes Acquisition of Forte Design Systems13 Feb 2014: Cadence Tensilica HiFi Audio Tunneling for Android Cuts Audio Processing Power by Up to 14X12 Feb 2014: Cadence Showcases System Development Solutions for Advanced Driver Assistance Systems at embedded world 201412 Feb 2014: Microsoft Employs Cadence Tensilica Processors in Xbox One12 Feb 2014: Cadence Acquires High Speed Interface IP Assets of TranSwitch Corporation, Further Expanding IP Portfolio for Mobile/Consumer Market11 Feb 2014: Cadence Showcases Key Mobile Technologies at Mobile World Congress 201410 Feb 2014: Cadence President and Chief Executive Officer Lip-Bu Tan to Present at the Morgan Stanley Technology, Media & Telecom Conference05 Feb 2014: Cadence to Enhance High-Level Synthesis Offering with Acquisition of Forte Design Systems
January
29 Jan 2014: Cadence DDR4 PHY IP Achieves 2667 Mbps Performance – Fastest in the Industry29 Jan 2014: Cadence Reports Fourth Quarter and Fiscal Year 2013 Financial Results22 Jan 2014: Cadence Design Systems and Berkeley Design Automation Settle Lawsuit15 Jan 2014: DesignCon 2014: Get a Sneak Peak of Sigrity 16.63 at Cadence Booth #50714 Jan 2014: Cadence C-to-Silicon Compiler Helps Renesas Realize Quick HEVC IP Development13 Jan 2014: Cadence Incisive 13.2 Platform Sets New Standard for SoC Verification Performance and Productivity10 Jan 2014: Cadence Announces Fourth Quarter and Fiscal Year 2013 Financial Results Webcast06 Jan 2014: Cadence Licenses Fraunhofer AAC Codecs to Further Expand Tensilica HiFi Audio/Voice Software Library02 Jan 2014: Cadence Senior Vice President and Chief Financial Officer Geoff Ribar to Present at the Needham Growth Conference
 
케이던스 코리아(유)
경기도 성남시 분당구 판교로 344
엠텍IT타워 9층/2층(교육장)
(구. 삼평동 688-1)
전화번호: 031-728-3111(代)
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