Silicon success

Silicon success

Success Stories

Cadence and Bayside Design, Inc.
Cadence Allegro Platform Enables Low-cost, High-density Build-up Package for 6.5G SerDes IC

Cadence and Huawei Technologies
Huawei Speeds PCB Design Process by More than 25% with Cadence Allegro Platform

Cadence and Stretch, Inc
Stretch Achieves 1Silicon Success? With Encounter Platform and Engineering Services

Cray Inc.
Cray Dramatically Accelerates Design Schedule Using Cadence Virtuoso Layout Migrate Solution

Cray Inc.
Cray Meets Aggressive ASIC Design Schedule, Leveraging Results from Encounter Test to Accelerate System Bring-Up

Fujitsu Microelectronics Europe
Fujitsu in Europe Adopts New SystemC Verfication Methodology, Leveraging Cadence VCAD Engineering Services to Significantly Accelerate Ramp-Up

Honeywell
Cadence Services Develop PDK for the Honeywell SOI4 Process on Schedule, on Budget, and to the Satisfaction of the DOD

Marconi Communications
"Partner Through Production" Approach yields New PCB Design Environment

NemeriX
NemeriX Partners with Cadence VCAD Engineering Services Team to Meet Aggressive Power and Performance Goals for Next-Generation GPS Baseband IC

ZMD on Cadence Encounter platform and VCAD services
ZMD and Cadence work together to produce cutting edge, low power ZigBee solution

Videos

		Bob Bridge Zilker Labs CEO Zilker Labs and Cadence merge power management and power conversion into the ZL 2005 IC. RealMedia:Low (35K) \| Med(100K) \| High(250K)

		Dave Shepard Sequoia Communications President & CEO Sequoia and Cadence develop revolutionary new RF transceiver architecture. RealMedia:Low (35K) \| Med(100K) \| High(250K)

		Doug Shute Bitwave Semiconductor CEO Bitwave and Cadence combine to develop software-defined radio. RealMedia:Low (35K) \| Med(100K) \| High(250K)

		Eric Broockman Alereon, Inc. CEO Cadence and Alereon partner to design the world's highest performance ultrawideband chipset. RealMedia:Low (35K) \| Med(100K) \| High(250K)

		John Glossner Sandbridge Technologies CTO Sandbridge and Cadence set out to revolutionize mobile handsets with a multi-threaded DSP architecture. RealMedia:Low (35K) \| Med(100K) \| High(250K)

		Paul Nahi Crimson Microsystems President and CEO Crimson and Cadence work together to create the worlds most advanced MSPP-on-a-chip. RealMedia:Low (35K) \| Med(100K) \| High(250K) Windows Media: High(512K)

		Thilo von Selchow ZMD CEO ZMD and Cadence Engineering Services work together to produce cutting edge ZigBee wireless solution RealMedia:Low (35K) \| Med(100K) \| High(250K)

		Tim Richardson Micro Linear CEO Micro Linear and Cadence collaborate on successful next-generation RF transceiver design. RealMedia:Low (35K) \| Med(100K) \| High(250K)

		Toby Farrand Chief Technical Officer, Digeo Digeo and Cadence Engineerings Services collaborate to achieve first silicon success on X-Stream project. RealMedia:Low (35K) \| Med(100K) \| High(250K)

		Vincent Mouret NemeriX Cadence and NemeriX team up to produce industry leading GPS Chipset RealMedia:Low (35K) \| Med(100K) \| High(250K)

Cadence Design Systems, Inc.