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Silicon Engineering Increased design complexity and reduced market windows make it critical to minimize iterations and maximize the efficiency of your silicon. Conventional approaches, which evolved to address VLSI design requirements, don't apply in the nanometer era. There simply is not enough time to iterate to success and still achieve business goals. The Cadence approach is simple. We focus on helping you mitigate the risks involved in implementing high-end communications, wireless and consumer, and custom analog designs. You concentrate on the high value-added areas of architecture and logic, and we take your RTL or netlist code and work with you to optimize it in silicon. Cadence is uniquely equipped to collaborate with your design teams to analyze and improve the quality of your code. Our silicon engineering teams have achieved an unrivaled silicon success rate by employing world-class expertise in:
 | Interconnect-centric, hierarchical design flows from RTL to GDSII, to address complex topologies, power, signal integrity, and timing interactions | | Design for Test (DFT) that allows you to focus 100 percent on design functionality and ensure testable chip | | Nanometer process and physical effects to allow accurate abstraction of detailed physical parameters to model noise issues, on-chip process variation, circuit delays, clock and power routing, and other critical factors impacting design performance | | Fully hierarchical timing analysis that assesses complex topology, signal integrity, and timing interaction to help you achieve fast, scalable, and accurate timing | | High-performance clock distribution in P&R environments vs. manual routing, achieving tight insertion delays and skew controls that would normally be available only in a custom design environment | | Power/current distribution and management, satisfying process electromigration and on-chip IR drop requirements | | Extensive high-pin-count, noise-sensitive, timing-critical I/O pin assignment and flip-chip development | | Silicon-package-board co-design to include package and system impact on chip performance, ensuring chip functionality not only on the ATE but also within your system |
Cadence also has access to the latest electronic design automation (EDA) technologies, strong partnerships with foundries, relationships with leading third-party IP providers, and a portfolio of select Cadence IP that is optimized, proven, and characterized for specific process technologies. The result is silicon optimized to your design—not over engineered—that meets your time-to-volume goals. Our VCAD collaborative model provides a low-risk path to optimal silicon, providing the know-how required to develop your own nanometer SoC implementation capability. And our expertise in supply chain management provides the surest route from silicon to package to board.
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