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Cadence digital IC design services The complexity of nanometer-scale digital ICs can play havoc with the predictability of design schedules. In these very large chips, the percentage of total delay due to wire delay increases significantly. Process nodes of 130 nanometers and below also exacerbate physical effects such as signal integrity (SI) effects and IR (voltage) drop. Both of these factors can introduce timing variations and other violations that surface late in the design cycle, requiring tedious manual repairs and delaying your schedule. Compressed market windows and the spiraling costs of masks and silicon respins simply compound these risks. As you design very complex, high-performance ICs, Cadence Engineering Services helps you not only achieve successful tape-outs but also regain predictability in your schedules. Cadence leverages a proven approach that considers wires first, and incorporates several new technologies and methodologies that reduce errors and prevent excessive iterations. Our collaborative approach offers you a range of engagement options. To get your design to successful tape-out, we start by considering your design environment and project goals. Together we craft a solution that best suits your business and technical needs. This ranges from augmenting your team with experienced digital IC design engineers to help you achieve a successful tape-out, to taking on silicon implementation. Many companies look to Cadence Engineering Services to shoulder a greater share of the risk. We have the industry's leading track record for successful first-pass silicon results. Silicon success
We can help your design team quickly master the nanometer design capabilities enabled by the Cadence Encounter™ digital IC design platform, and speed its implementation into your production environment. Get the most out of this advanced technology to solve your design challenges, including:
 | Signal integrity | | Timing closure | | Hierarchical design | | Library validation | | Chip tape-out |
Our experts in the Encounter platform can also work with you to customize a methodology and quickly implement it in your production environment, as well as assist with training and support.
Design For Test services
Cadence Design for Test (DFT) services bridge design and manufacturing challenges. Implemented in conjunction with Cadence Encounter Test Solutions, DFT services help your design and test engineers reduce test costs and achieve superior test coverage to aid in product quality improvement. Cadence helps semiconductor and system makers accelerate defect identification and yield improvement, reducing time-to-volume and time-to-yield. DFT services include:
| Migration assistance in moving from third-party test tools | | Logic and advanced/custom memory built-in self test (BIST) | | "Vectorless signoff" flow development and deployment | | Diagnostic analysis for fault isolation and yield learning |
| Encounter digital IC design platform |
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