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Technology Sessions
During our technology sessions, Cadence provided in-depth presentations and demonstrations of our technologies and methodologies that help you realize the highest quality silicon chips, systems-on-chip devices, and complete systems at lower costs. Session options included our latest solutions in the areas of signoff, mixed signal, low power, RTL-to-GDSII, custom, functional verification, verification IP, system development and hardware/software integration, high-level synthesis, PCB, and IC packaging. For more information about the technology sessions, send an email to events@cadence.com.