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Industry Insights Blog

Q&A: From Customer to R&D Director of FPGA-Based Prototyping

Vahid Ordoubadian, senior group R&D director at Cadence, has a unique perspective when it comes to emulation and FPGA-based prototyping—he was a user of these technologies for many years. In early 2014, he left Broadcom and joined Cadence, where...  Read More »
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PCB West 2014: IPC-2581 Data Transfer Format Links Design, Manufacturing

IPC-2581 is rapidly gaining support in the PCB design community as an "intelligent," vendor-neutral format that can bring design data into manufacturing in a single file. The PCB West conference in Santa Clara, California on Sept. 10, 2014 provided...  Read More »
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Cadence at ARM TechCon 2014—High Performance, Low Power, Mixed Signal, and More

ARM TechCon 2014, set for October 1 – 3 in Santa Clara, California, is a key event for anyone who designs or programs ARM®-based systems-on-chip (SoCs). Cadence has a strong presence this year with five sponsored sessions, three technical papers...  Read More »
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Report Envisions Bold New Future for EDA

A series of workshops on "Extreme Scale Design Automation" has resulted in a report that identifies EDA research and funding priorities through 2025 and beyond. The report cites today's challenges and shortcomings, but it also envisions...  Read More »
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Electromigration – What IC Designers Need to Know

If a chip that was previously working fails in the field, the impact could range from a minor nuisance (for a disposable consumer product) to a major tragedy (for a pacemaker or automobile safety system). That's why reliability is so important in...  Read More »
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IBM Lithography Expert: Making 10nm IC Design Possible

Development work is underway on the 10nm process node - but can we get there with conventional lithography? In a recorded presentation available at the Cadence web site, Lars Liebmann, distinguished engineer at IBM, says yes - but he notes that it will...  Read More »
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3D-IC Working Group—Tool Support Needed, But “Gaps” May Be Narrowing

Where are the gaps in 3D-IC design, and how can they best be bridged? In order to provide a cost-effective alternative to silicon process scaling, work is still needed in 3D-IC design tools and methodologies, according to presenters at a recent meeting...  Read More »
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Designer View – RTL Synthesis Success Strategies at 28nm and Below

RTL synthesis is not a simple pushbutton tool, especially at 28nm and below. In a recorded presentation at the Cadence web site Ramesh Rajagopalan, chip lead for physical implementation of networking SoCs at Cisco Systems, shares some of his company's...  Read More »
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Q&A: Kathryn Kranen Discusses Jasper, Formal Verification, and the Cadence Acquisition

Few individuals have been as visible and influential in the EDA industry as Kathryn Kranen, CEO of formal verification pioneer Jasper Design Automation until its acquisition by Cadence in June 2014. Kranen was also CEO of Verisity Design in the late 1990s...  Read More »
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Flash Memory Summit: 3D NAND Flash Faces Cost, Reliability Challenges

3D NAND Flash architectures will provide the best option for increasing storage densities in future years, according to panelists at a plenary session at the Flash Memory Summit Aug. 5, 2014. But given the large manufacturing investment required, and...  Read More »
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