Miniaturization Through Embedding Packaged Components – Part2
By
Hemant Shah
on
May 23, 2011
This blog was written by a guest blogger – Mark Beesley of AT&S. His company is a global leader in supplying advanced interconnect solutions to the high-end electronics sector. AT&S leads HERMES, a European consortium focused on developing
Read More »
Comments
(0)
|
 |
Miniaturization Through Embedded Packaged Components
By
Hemant Shah
on
May 10, 2011
As consumers we are very familiar with product miniaturization trends. We demand more functionality in smaller sizes that have longer battery life all the time. The electronics market has been delivering to those customer expectations not just in consumer
Read More »
Comments
(1)
|
 |
Shorter, Predictable Design Cycles (SPDC) – Ensuring Critical Signals Have a Return Path
By
Hemant Shah
on
February 14, 2011
This is third in the series of blog posts about making your design cycles predictable and shorter for dense PCBs that have highly constrained high-speed interfaces such as DDR2, DDR3, SATA II/III, and USB 3.0. The first post talked about using ECSets
Read More »
Comments
(0)
|
 |
A Shorter, Predictable Design Cycle for Complex PCBs - Dynamic Phase Control
By
Hemant Shah
on
November 18, 2010
This is second in a series of blog posts about making your design cycles shorter and more predictable for increasingly complex PCB designs. In my last post I talked about using ECSets and Topology Apply capabilities for high-speed standards based interfaces
Read More »
Comments
(0)
|
 |
A Shorter, Predictable Design Cycle for Complex PCBs -- Electrical Constraint Sets (ECSets)
By
Hemant Shah
on
October 29, 2010
This is the first in a series of blogs focused on how you can make your design cycle predictable and shorter for PCB designs that are increasing in complexity. PCB designers have to deal with increased complexities while design teams are dispersed geographically
Read More »
Comments
(0)
|
 |
Innovative Approach to Optimized FPGA Pin Assignment
By
Hemant Shah
on
May 18, 2009
Cadence has been a leader in silicon-package and package-board co-design for over a decade now. Today, Cadence introduced a new and innovative solution for FPGA-PCB Co-design. The FPGA-PCB co-design solution includes proven technology from Taray Inc for
Read More »
Comments
(4)
|
 |
SPB 16.2 release - Constraint Driven HDI PCB Design Flow
By
Hemant Shah
on
August 18, 2008
Today's SPB 16.2 release is significant for the Cadence Allegro and OrCAD families of products, but more importantly, I think it brings a lot of new functionality for PCB designers. I will be talking about the improvements in this release over a few
Read More »
Comments
(5)
|
|
View older posts
»
|