Home > Community > IC Packaging and SiP Design
 
Login with a Cadence account.
Not a member yet?
Create a permanent login account to make interactions with Cadence more conveniennt.

Register | Membership benefits
Cadence Launches 'Industry Insights' Blog Richard Goering blogs on issues and technologies with an industry-wide perspective.
Visit the blog »
 
How did you learn about the new Cadence Community?


 
 

Share
  • Email
  • Social Web
* Required Fields

Recipients email * (separate multiple addresses with commas)

Your name *

Your email *

Message *

Contact Us

Cadence Contacts

Global Office Locator
Find Offices worldwide »

Sales Inquiry
Request for Product information »
Cadence Channel Partners »

Corporate Headquarters
Cadence Design Systems, Inc.
2655 Seely Avenue
San Jose, CA 95134
Phone: 408.943.1234
* Required Fields
First Name *

Last Name *

Email *

Company / Institution *

Comments: *

IC Packaging and SiP Community

 
Everything You Want to Know About APD / SiP 16.2 - Bill Acito Webinar on March 18
 By Brad Griffin on March 11, 2009
(N ote: Click here to view Bill Acito's webinar.) If you caught Jerry GenPart 's blog in November on Advanced Plating Bar Checks and wondered what else is new in APD 16.2, you are in luck. On Wed, March 18, Bill Acito, Product Engineer, will review... Read more »
Comments (2)
 
Filed under: , , , , ,
 

 
Brad Griffin Speaks at DesignCon - Give Him a Listen!!
 By Keith Felton on February 05, 2009
If you were not lucky enough to be atDesignCon this week, and many of us were not! You might be interested in the streaming interviews posted on line. Click here for link. Scroll down the video soundbites in the right hand pane, list to what Brad says... Read more »
Comments (0)
 
Filed under: , , , , , , , ,
 

 
Cadence SiP and IC Packaging at DesignCon
 By Brad Griffin on January 23, 2009
Those of you attending DesignCon in February should stop by the Cadence booth to see the latest integration of PakSi-E in SiP SI. This integration not only supports signal integrity, but also there is new package power integrity technology. We will also... Read more »
Comments (1)
 
Filed under: , , , , ,
 

 
View older posts »
Visit the IC Packaging and SiP Design forum »

There are 36 guest(s) and 0 member(s) online:


Most Active Users


Community Guidelines
The Cadence Design Communities support Cadence users and technologists interacting to exchange ideas, news, technical information, and best practices to solve problems and get the most from Cadence technology. The community is open to everyone, and to provide the most value, we require participants to follow our Community Guidelines that facilitate a quality exchange of ideas and information. By accessing, contributing, using or downloading any materials from the site, you agree to be bound by the full Community Guidelines.