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IC Packaging and SiP Community

 
Advances in Leadframe Packaging Lead Cadence and CDS to Collaboration
 By Team Allegro on June 27, 2011
One thing is certain about IC Package technology -- things change quickly. Leadframe package technology is one of the oldest, most reliable and cost effective ways to connect a die to a printed circuit board. However, until recently, it had been considered... Read more »
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Cisco and Cadence Present Co-design Paper at DesignCon
 By Team Allegro on February 01, 2011
Today at DesignCon, be sure to drop by Room 203 at 11:05 and see Cisco and Cadence present a paper that embedded.com told their newsletter subscribers will “capture the essence of the presentations at the conference and the quality of the technical... Read more »
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Favorite Features of an IC Package Designer: Wirebonding
 By Team Allegro on November 08, 2010
This is the fourth in a series of discussions we would like to open up regarding “favorite features” in an IC Packaging implementation design tool. While wirebond packages are nothing new, the challenges associated with package designs using... Read more »
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