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 IEEE ISQED08 - Call for Papers 

Last post Sun, Oct 28 2007 2:27 PM by archive. 0 replies.
Started by archive 28 Oct 2007 02:27 PM. Topic has 0 replies and 3615 views
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  • Sun, Oct 28 2007 2:27 PM

    • archive
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    IEEE ISQED08 - Call for Papers Reply

    FINAL CALL FOR PAPERS

    ISQED 2008
    International Symposium and Exhibits in Quality Electronic Design
    Leading Design for Quality & Manufacturability™


    Paper Submission Deadline:  October 29, 2007
    Acceptance Notifications:  November 23, 2007
    Final Camera-Ready paper:  January 3, 2008

    The International Symposium on Quality Electronic Design (ISQED) is a premier Design & Design Automation conference, aimed at bridging the gap between and integration of, electronic design tools and processes, integrated circuit technologies, processes & manufacturing, to achieve design quality. ISQED is the pioneer and leading international conference dealing with the design for manufacturability and quality issues front-to-back.  ISQED spans three days, Monday through Wednesday, in three parallel tracks, hosting near 100 technical presentations, several keynote speakers panel discussions, workshops /tutorials and other informal meetings. Conference proceedings are published by IEEE and hosted in the digital library. Proceedings CD ROMs are published by ACM.  In addition, continuing the tradition of reaching a wider readership in the IC design community, ISQED will continue to publish special issues in leading journals. The authors of high quality papers will be invited to submit an extended version of their papers for the special journal issues.



    Papers are requested in the following areas:

    A pioneer and leading multidisciplinary conference, ISQED accepts and promotes papers related to the manufacturing, VLSI design and EDA. Authors are invited to submit papers in the various disciplines of high level design, circuit design, test & verification, design automation tools; processes; flows, device modeling, semiconductor technology, and advance packaging.



    - Design for Manufacturability/Yield & Quality (DFM/DFY/DFQ)
    - Effects of Technology on IC Design, Performance, Reliability, and Yield (TRD)
    - System-level Design, Methodologies & Tools (SDM)
    - Package - Design Interactions & Co-Design  (PDI
    - Robust & Power-conscious Devices, Interconnects, and Circuits (PCC
    - Emerging/Innovative Process & Device Technologies and Design Issues (EDT)
    - Design of Reliable Circuits and Systems (DFR)
    - EDA Methodologies, Tools, Flows & IP Cores; Interoperability and Reuse (EDA)
    - Design Verification and Design for Testability (DVFT)
    - Physical Design, Methodologies & Tools (PDM)



    Details of various topics of interest to ISQED, and the paper submission process are provided in the ISQED web-site (http://www.isqed.org).



    Sincerely,

    Lalitha Immaneni, ISQED08 TPC Chair
    Pallab Chatterjee, ISQED08 Conference Chair
    Tanay Karnik, ISQED08 General Chair


    Originally posted in cdnusers.org by loriann555
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