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 Placing bond pads for inline IOs 

Last post Thu, Apr 19 2012 5:19 AM by Anjana. 1 replies.
Started by gops 04 Jun 2010 03:24 AM. Topic has 1 replies and 1340 views
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  • Fri, Jun 4 2010 3:24 AM

    • gops
    • Top 75 Contributor
    • Joined on Wed, Sep 24 2008
    • Trivandrum, Kerala
    • Posts 118
    • Points 2,505
    Placing bond pads for inline IOs Reply

    Hope all are doing great.

    I have some query regarding the placement of bondpads in encounter.My design is not flip chip type, so the command placeBondPad command didn't worked in it.But some one please tell me, how you place the bondpads in the design.

    I have already added the pad into my design using addInst command.But I need to place it at my pins of the IO cells.Please help me for the same.

    • Post Points: 20
  • Thu, Apr 19 2012 5:19 AM

    • Anjana
    • Not Ranked
    • Joined on Wed, Feb 22 2012
    • Posts 12
    • Points 135
    Re: Placing bond pads for inline IOs Reply

    I understand that this is a very old post, but if you are still active in the community - how did you resolve it ? Did you write a script like a script for placing the IOs to place the bond pads ?

    • Post Points: 5
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Started by gops at 04 Jun 2010 03:24 AM. Topic has 1 replies.