IC Packaging and SiP

Advances in Leadframe Packaging Lead Cadence and CDS to Collaboration

TeamAllegro — Mon, 27 Jun 2011 14:00:00 GMT

One thing is certain about IC Package technology -- things change quickly. Leadframe package technology is one of the oldest, most reliable and cost effective ways to connect a die to a printed circuit board. However, until recently, it had been considered...(read more)

Cisco and Cadence Present Co-design Paper at DesignCon

TeamAllegro — Tue, 01 Feb 2011 15:00:00 GMT

Today at DesignCon, be sure to drop by Room 203 at 11:05 and see Cisco and Cadence present a paper that embedded.com told their newsletter subscribers will “capture the essence of the presentations at the conference and the quality of the technical...(read more)

Favorite Features of an IC Package Designer: Wirebonding

TeamAllegro — Mon, 08 Nov 2010 14:00:00 GMT

This is the fourth in a series of discussions we would like to open up regarding “favorite features” in an IC Packaging implementation design tool. While wirebond packages are nothing new, the challenges associated with package designs using...(read more)

Favorite Features Of An IC Package Designer: Assembly Rule Checks

TeamAllegro — Wed, 28 Jul 2010 19:01:00 GMT

This is the third in a series of discussions we would like to open up regarding "favorite features" in an IC Packaging implementation design tool. As the industry continues to include larger numbers of larger die in a smaller IC package, the...(read more)

Catch A Full-Wave Summer Kickoff Webinar: CST 3D Extraction Integrated With Cadence SiP

TeamAllegro — Fri, 28 May 2010 17:45:00 GMT

Is there anyone who does not carry a mobile communication device anymore? Sending and receiving phone calls seem to be just a minor feature on these devices nowadays. With texting, email, Wi-Fi, GPS, camera, video, image recognition software, and many...(read more)

Favorite Features Of An IC Package Designer: Rich And Diverse Set Of Import And Export File Formats

TeamAllegro — Thu, 20 May 2010 21:17:00 GMT

This is the second in a series of discussions we would like to open up regarding “favorite features” in an IC Packaging implementation design tool. Recently on a visit to an avid user of IC Package design tools, we heard the requirement mantra...(read more)

Favorite Features of an IC Package Designer: Flexible 3D Viewing

TeamAllegro — Wed, 28 Apr 2010 15:00:00 GMT

This is the first in a series of discussions we would like to open up regarding “favorite features” in an IC Packaging implementation design tool. We talk to customers all the time that are designing IC packages with stacked die. While trough-silicon...(read more)

APD and SiP Layout 16.3 - Virtual-ly Amazing

Maxwell86 — Fri, 04 Dec 2009 21:30:00 GMT

On December 2, the Cadence Allegro team went live with the Cadence Allegro and OrCAD 16.3 Virtual Conference (CAO16.3). This virtual first in EDA was an amazing success with hundreds of visitors, many of whom visited the SiP and IC Packaging booth. If...(read more)

Everything You Want to Know About APD / SiP 16.2 - Bill Acito Webinar on March 18

Maxwell86 — Wed, 11 Mar 2009 15:06:00 GMT

(Note: Click here to view Bill Acito's webinar.)

If you caught Jerry GenPart's blog in November on Advanced Plating Bar Checks and wondered what else is new in APD 16.2, you are in luck. On Wed, March 18, Bill Acito, Product Engineer, will review the long list of new technology available in the latest release.

As an example, you'll see how the latest HDI technology in the Allegro platform is supported in APD / SiP.

And also the wirebond enhancements.

Please join us for the webinar. To register to see it live or view an archived recording (after March 18), please click here and choose the What's New in IC Packaging / SiP webinar.

We look forward to your feedback on this foray through the latest and greatest APD features.

Brad Griffin Speaks at DesignCon - Give Him a Listen!!

SiPper — Thu, 05 Feb 2009 18:00:00 GMT

If you were not lucky enough to be atDesignCon this week, and many of us were not! You might be interested in the streaming interviews posted on line. Click here for link.

Scroll down the video soundbites in the right hand pane, list to what Brad says is the emerging trend and focus regarding today's advanced node IC's.

Enjoy!!