Home > Cadence 中国 > 公司产品 > IC封装与SiP 设计新闻与活动

IC封装与SiP 设计 

Press Releases
Cadence SiP Technologies and Allegro Package Designer Optimized for Hand-Held Consumer Electronics Market
IC Package Designers Boost Productivity with New Cadence Allegro SiP and IC Packaging Software
Cadence Extends Performance Leadership with Expanded Multi-Core Support

Multi-Fabric Planning for Efficient PCB Design
3D packaging takes a key step forward as TSMC tapes out CoWoS chips
IC Package prototyping methodology estimates feasibility and cost


 Content Query Web Part ‭[3]‬