Conference Agenda : Tuesday, May 19
| 07:30 - 08:30 |
Breakfast & Registration |
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| 8:30 - 9:15 |
Keynote: Succeeding in Today's Dynamic Electronics Industry
Lip-Bu Tan, President and Chief Executive Officer, Cadence Design Systems, Inc.
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| 9:15 - 10:00 |
Industry Keynote: ARM Business Environment and Strategy Ian Drew, EVP Marketing, ARM
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| 10:00 - 10:30 |
Coffee Break |
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| 10:30 - 11:00 |
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Custom Design Track |
Digital Implementation Track |
Functional Verification Track |
Logic Design Track |
Silicon-Package Board Track |
Academic Track |
CD01
Process Design Kit for a modular technology platform exploiting new ITDB infrastructure.
STMicroelectronics |
DI01
The ART of IC Design - Pushing the limits NEC |
FV01
Re-using OVM test benches for verifying the integration of modules into a system NEC |
LD01
Formally Verifying Clock Domain Crossings in Lock-Step Safety Devices Using LEC CDC and IFV Freescale Semiconductor |
SPB01
PCB/SPB Roadmap |
AC01
An open platform for Low Power VLSI design research and teaching
Technical University of Braunschweig, Germany
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| 11:00 - 11:30 |
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CD02
First project experience with the IC6.1.3 environment Austria Micro Systems |
DI02
Using CCD to filter critical paths for @speed pattern generation
Freescale Semiconductor
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FV02
IP Integration Verification using the OVM and Cadence AHB/AXI UVCs NEC
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LD02
Verifying Your SDCs from RTL to P&R – Two Customer Examples Cadence Design Systems
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Continue
PCB/SPB Roadmap |
AC02
Advanced Verification in the Implementation of Large Research Projects University of Heidelberg, Germany University of Bristol, UK
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| 11:30 - 12:00 |
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CD03
X-FAB's methodology for design kit- and project- migration to IC6.1 X FAB |
DI03
Tape-out while you sleep: towards an automated ECO generation flow for faster design closure Silicon & Software Systems
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FV03 Functional Verification Roadmap
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LD03
Early Exploration of Network Processor Architectures Using Cadence InCyte Chip Estimator Heinz Nixdorf Inst
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SPB02
Creepage Distance Analysis on PCBs with NEXTRA Mecadtron GmbH
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AC03
Frequency Compensation by Automated Topology Modification Using Mixed Analytical and Numerical Methods for Design of Fast Optoelectronic Applications Ilmenau University of Technology Institute for Microelectronic and Mechatronic Systems (IMMS) gGmbH, Germany
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| 12:00 - 12:30 |
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CD04
A Novel EDA-Compatible Methodology for Design and Simulation of MEMS with IC Coventor
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DI04
Device Configuration and Memory Repair Architecture for Embedded Micro Controllers Freescale Semiconductor
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Continue Functional Verification Roadmap
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LD04 CoReUse and Qcore: Reuse and safeguard IP NXP
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SPB03
New Technologies for 6 Gbps Serial Link Design & Simulation, a Case Study Siguys.com
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AC04
Toward 4G Nanometer Radio Receivers: Design Methodology and a Case Study
KTH Stockholm, Sweden
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| 13:45 - 14:15 |
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CD05
Verification of High Performance ADC in IC61 Arctic Silicon Devices
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DI05
Improving Clock Distribution Quality Through Early Visualization Freescale Semiconductor
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FV04
Efficient and Exhaustive Verification: possible or dream? FBE Asic
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LD05 Logic Design Roadmap
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SPB04
Post Layout EMC Analyses for PCBs SimLab Software GmbH
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AC05
Methodology Comparison for Designing MEMS Sensor Read-Out Circuits University of Freiburg, Germany
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| 14:15 - 14:45 |
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CD06
Open Command Environment for running Advanced Analysis of Mixed Signal circuits (OCEAN-XL) Cadence Design Systems
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DI06
Enabling low perturbation ECOs in Post DFM advanced node designs Cadence Design Systems
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FV05
Managing a complex SoC verification project with eManager! Freescale Semiconductor
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Continue Logic Design Roadmap
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SPB05
High Density Interconnect (HDI) FlowCAD
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AC06
RAL Microelectronics Design and Support Centre STFC Rutherford Appleton Laboratory, UK
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| 14:45 - 15:15 |
Coffee Break |
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| 18:15 - 23:00 |
Evening event at Hilton |
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NOTE: Agenda is subject to change.