Home > CDNLive! > EMEA > 2009 > Agenda - Tuesday

Monday    |    Tuesday    |    Wednesday
Conference Agenda : Tuesday, May 19
07:30 - 08:30 Breakfast & Registration  
     
8:30 - 9:15 Keynote: Succeeding in Today's Dynamic Electronics Industry
Lip-Bu Tan, President and Chief Executive Officer, Cadence Design Systems, Inc.
     
9:15 - 10:00 Industry Keynote: ARM Business Environment and Strategy
Ian Drew, EVP Marketing, ARM
 
     
10:00 - 10:30 Coffee Break  


10:30 - 11:00  
Custom Design
Track
Digital Implementation
Track
Functional Verification
Track
Logic Design
Track
Silicon-Package Board
Track
Academic
Track
CD01
Process Design Kit for a modular technology platform exploiting new ITDB infrastructure.
STMicroelectronics
DI01
The ART of IC Design - Pushing the limits
NEC
FV01
Re-using OVM test benches for verifying the integration of modules into a system
NEC
LD01
Formally Verifying Clock Domain Crossings in Lock-Step Safety Devices Using LEC CDC and IFV
Freescale Semiconductor
SPB01
PCB/SPB Roadmap
AC01
An open platform for Low Power VLSI design research and teaching
Technical University of Braunschweig, Germany


11:00 - 11:30    
CD02
First project experience with the IC6.1.3 environment
Austria Micro Systems
DI02
Using CCD to filter critical paths for @speed pattern generation
Freescale Semiconductor
FV02
IP Integration Verification using the OVM and Cadence AHB/AXI UVCs
NEC
LD02
Verifying Your SDCs from RTL to P&R – Two Customer Examples
Cadence Design Systems
Continue
PCB/SPB Roadmap
AC02
Advanced Verification in the Implementation of Large Research Projects
University of Heidelberg, Germany
University of Bristol, UK


11:30 - 12:00    
CD03
X-FAB's methodology for design kit- and project- migration to IC6.1
X FAB
DI03
Tape-out while you sleep: towards an automated ECO generation flow for faster design closure
Silicon & Software Systems
FV03
Functional Verification Roadmap
LD03
Early Exploration of Network Processor Architectures Using Cadence InCyte Chip Estimator
Heinz Nixdorf Inst
SPB02
Creepage Distance Analysis on PCBs with NEXTRA
Mecadtron GmbH
AC03
Frequency Compensation by Automated Topology Modification Using Mixed Analytical and Numerical Methods for Design of Fast Optoelectronic Applications
Ilmenau University of Technology
Institute for Microelectronic and Mechatronic Systems (IMMS) gGmbH, Germany


12:00 - 12:30    
CD04
A Novel EDA-Compatible Methodology for Design and Simulation of MEMS with IC
Coventor
DI04
Device Configuration and Memory Repair Architecture for Embedded Micro Controllers
Freescale Semiconductor
Continue
Functional Verification Roadmap
LD04
CoReUse and Qcore: Reuse and safeguard IP
NXP
SPB03
New Technologies for 6 Gbps Serial Link Design & Simulation, a Case Study
Siguys.com
AC04
Toward 4G Nanometer Radio Receivers: Design Methodology and a Case Study
KTH Stockholm, Sweden


12:30 - 13:45 Lunch  


13:45 - 14:15    
CD05
Verification of High Performance ADC in IC61
Arctic Silicon Devices
DI05
Improving Clock Distribution Quality Through Early Visualization
Freescale Semiconductor
FV04
Efficient and Exhaustive Verification: possible or dream?
FBE Asic
LD05
Logic Design Roadmap
SPB04
Post Layout EMC Analyses for PCBs
SimLab Software GmbH
AC05
Methodology Comparison for Designing MEMS Sensor Read-Out Circuits
University of Freiburg, Germany


14:15 - 14:45    
CD06
Open Command Environment for running Advanced Analysis of Mixed Signal circuits (OCEAN-XL)
Cadence Design Systems
DI06
Enabling low perturbation ECOs in Post DFM advanced node designs
Cadence Design Systems
FV05
Managing a complex SoC verification project with eManager!
Freescale Semiconductor
Continue
Logic Design Roadmap
SPB05
High Density Interconnect (HDI)
FlowCAD
AC06
RAL Microelectronics Design and Support Centre
STFC Rutherford Appleton Laboratory, UK


14:45 - 15:15 Coffee Break  


15:15 - 16:15    
Custom Design
demo

Speed up your Spectre/MultiMode Simulation without sacrificing accuracy and no change in the use model
Digital Implementation
demo

Increasing Mixed-Signal Designer Productivity using Virtuoso and Encounter Technology
Functional Verification
demo

New Debug Features in Specman/Incisive Enterprise Simulator XL
System Design & Verification demo
Next-Generation High-Level Synthesis (HLS) to Enable TLM-Driven Design and Verification
Silicon-Package Board
demo

A Unique FPGA-PCB Co-Design Solution
Language & Methodology / Hands-On (run by Education Services)
TLM - Head Start


16:15 - 17:15    
Custom Design
demo

Next-generation Mixed-Signal Simulation
Digital Implementation
demo

CPF-Enabled Cadence Low-Power Solution
Functional Verification
demo

Metric-Driven Verification with Assertion-Based Verification
System Design & Verification demo
Using Fast Models from ARM with Incisive Technology for Verification and Analysis
Silicon-Package Board
demo

High-Density Interconnect (HDI) Design
Language & Methodology / Hands-On (run by Education Services)
Advanced Specman - Integrating UVC\'s into larger environments and how Aspect Orientation helps productivity


17:15 - 18:15    
Custom Design
demo

Virtuoso Custom Design Platform 6.1.3 – the Art of Engineering, Amplified
Digital Implementation
demo

Design at Advanced Nodes with the New Encounter Digital Implementation System
Functional Verification
demo

Next-Generation Coverage Contribution using Formal Analysis
System Design & Verification demo
Third-Party Virtual Platform Integration with Incisive Technology
Silicon-Package Board
demo

Achieve Shorter, More Predictable Design Cycles with an RF-Aware PCB Design Environment
Language & Methodology / Hands-On (run by Education Services)
SystemVerilog OVM (Open Verification Methodology)- Head Start


18:15 - 23:00 Evening event at Hilton  


Hardware Demos at Cadence Booth in Expo area
- Complete ARM-Based HW/SW Co-Verification Environment using Palladium III
- Transaction-Based Acceleration for an Ethernet-Based Design using Xtreme III
- System-Level Power Analysis with Palladium III / Dynamic Power Analysis
- Emulation of Wireless SoCs with Palladium III and a Protocol Tester
- Compliance Management System demo using Cadence Incisive Verification IP

NOTE: Agenda is subject to change.