NextIO |
James Wei NextIOJames Wei, Director ASIC Development at NextIO, discribes the benefits of using Cadence Services to reduce risk and meet schedule targets accurately and predictably. |  |
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Tagent |
Jarie Bolander
Tagent
Jarie Bolander, Tagent Co-Founder and Vice President of R&D talks about how Cadence Hosted Design Solutions and Services helped Tagent develop the first-ever Antenna on Chip. |  |
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Micro Linear |
Tim Richardson Micro LinearTim Richardson, CEO of Micro Linear talks about how Micro Linear and Cadence collaborate on world's first 1.9-gigahertz RF transceiver IC with a fully integrated power amplifier, the ML1900.
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Zilker Labs |
Bob Bridge Zilker LabsBob Bridge, CEO of Zilker Labs talks how Zilker Labs and Cadence merge power management and power conversion into the ZL 2005 IC.
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Sequoia Communications |
Dave Shepard SequoiaDave Shepard, President and CEO of Sequoia Communications talks how Sequoia and Cadence develop revolutionary new RF transceiver architecture.
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Bitwave |
Doug Shute BitwaveDoug Shute, CEO of Bitwave Semiconductor talks about how Bitwave and Cadence combine to develop software-defined radio.
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Alereon |
Eric Broockman Alereon, Inc.Eric Broockman, CEO from Alereon, Inc. and Cadence partner to design the world's highest performance ultrawideband chipset.
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Sandbridge |
John Glossner SandbridgeJohn Glossner, CTO of Sandbridge Technologies talks how Sandbridge and Cadence set out to revolutionize mobile handsets with a multi-threaded DSP architecture.
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Crimson Microsystems |
Paul Nahi Crimson MicrosystemsPaul Nahi, President and CEO of Crimson Microsystems talks about how Crimson and Cadence work together to create the worlds most advanced MSPP-on-a-chip.
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