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December

03 Dec 2007 GUC Joins Power Forward Initiative
 
October

11 Oct 2007 Faraday Joins Power Forward Initiative to Make Low-power Design Easier
 
September

10 Sep 2007 ARC Announces Ultra Low Power Technology "Energy PRO" that Lowers Core and Subsystem Power by Four Fold; Lead Customers Offered Early Access Program10 Sep 2007 ARC and Cadence Offer New Low-Power Design Methodology for Demanding Mobile Applications04 Sep 2007 Rambus And Cadence Collaborate And Deliver Fully Integrated And Independently Verified PCI Express Solutions
 
August

27 Aug 2007 Cadence Selects Wipro-New Logic's Wireless LAN IP for its SoC Functional Verification Kit 27 Aug 2007 Cadence Selects Chipidea's USB 2.0 IP For Its SoC Functional Verification Kit13 Aug 2007 New ARC VRaptor-Based Video Subsystems Receive Strong Industry Support
 
July

09 Jul 2007 OCP-IP Announces Support for Cadence's Assertion Based OCP Protocol Verification IP
 
June

19 Jun 2007 Taifatech Uses Cadence RF Kit to Reduce Their Wireless Chip Development Time by 30 Percent19 Jun 2007 SensorDynamics delivers first-time-right silicon with Virtuoso Platform and Incisive Enterprise Specman Technologies01 Jun 2007 Lightspeed Logic collaborates with Cadence to deliver Reconfigurable Logic Reference Flow
 
May

15 May 2007 Cadence Selects Wipro-New Logic's Wireless LAN IP for its Low-Power Methodology Kit
 
April

16 Apr 2007 ARC Building Advanced CPF-Enabled Flow to Lower Power Consumption of its Configurable Subsystems and Cores 04 Apr 2007 Dongbu Electronics Announces RF Process Design Kit Developed With Support Of Cadence Design Systems
 
March

05 Mar 2007 Common Power Format 1.0 Released by Si2's Low Power Coalition
 
February

03 Feb 2007 Cadence OrCAD tools win the Electronics For You (EFY) Reader's Choice Award 2007 for Design & Simulation Software
 
January

29 Jan 2007 Cadence Connections Partner Flomerics Thermal Design Software in Running For 2007 DesignVision Awards17 Jan 2007 Si2’s Low Power Coalition Receives Common Power Format Parser Source Code 12 Jan 2007 Si2 Low Power Coalition Issues Request for Technology11 Jan 2007 IEC Announces 2007 DesignVision Finalists Recognizing Best Tools and Products in Semiconductor Industry