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NEC Electronics Adopts Cadence Encounter Digital Implementation System for Leading-Edge 40-nm ASIC Designs
SAN JOSE, Calif. and KAWASAKI, Japan, 25 Jan 2010

Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic design innovation, and NEC Electronics Corporation (TSE: 6723), a leading provider of semiconductor solutions, today announced that NEC Electronics has adopted Cadence® Encounter® Digital Implementation (EDI) System and succeeded in more than ten complex ASIC designs targeting its CB40L (40 nanometer low power) process technology with several designs successfully taped out already. Utilizing more than 20 million gates, the scale of the new ASICs has increased by two- to four-times over previous designs targeting 55-nanometer (nm) and 90-nm process technologies. EDI Systems’ multi-threaded processing, netlist-to-netlist compilation, and integrated DFM optimization and timing signoff analysis, streamlined the large ASIC design processes.

“We are quite satisfied that the Cadence EDI System is fully capable of tackling our leading edge design challenges,” said Akira Denda, Department Manager of the Device Platform Development Department, 1st SoC Business Planning Division at NEC Electronics ASIC Division. “EDI System enabled us to tapeout an area-efficient design while sustaining time-to-market by leveraging the end-to-end, multi-threaded solution.”

The Cadence EDI System is a configurable and extensible high performance, high capacity, scalable design solution for high-density electronic design.

The larger an ASIC design becomes, the more variables stand in the way of correct implementation. EDI System and its key components, including Encounter Timing System and Encounter RTL Compiler, combine to bring predictability back into the equation, resulting in higher-quality silicon. At the same time, the multiprocessing capability of the integrated system enabled over 20 million-gate designs to be delivered with little increase in turnaround time. In addition, engineers can realize significant power savings and yield enhancement through advanced low power design and optimization techniques.

EDI System also provides a complete, consistent, and converging flow to address design-for-manufacturing (DFM) and variability effects (lithography, CMP, thermal, and process variations) in the early stages of the design flow. By integrating model-based DFM and statistical technology in a comprehensive prevention-analysis-repair flow, the Cadence solution is capable of handling huge designs and provides significant productivity gains over traditional DFM-closure solutions.

“The Cadence EDI System provides significantly improved productivity and time-to-market, while reducing both the cost and risk associated with advanced semiconductor design,” said Dr. Chi-Ping Hsu, senior vice president of implementation research and development at Cadence. “The EDI System enabled NEC Electronics to tape-out its 40-nm ASIC designs, involving the incredibly complex integration of over 20 million gates in a single, low-power, area-efficient device. We’re already lined up to execute additional advanced node designs with NEC Electronics, using EDI System with advanced node capabilities to reach fast, predictable design convergence.”

About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software and hardware, methodologies, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.

About NEC Electronics
NEC Electronics Corporation (TSE: 6723) specializes in semiconductor products encompassing advanced technology solutions for the high-end computing and broadband networking markets, system solutions for the mobile handset, PC peripheral, automotive and digital consumer markets, and multi-market solutions for a wide range of customer applications. NEC Electronics Corporation has 24 subsidiaries worldwide including NEC Electronics America, Inc. and NEC Electronics (Europe) GmbH. For additional information about NEC Electronics worldwide, visit www.necel.com.

For more information, please contact:
USA    
Dan Holden 
Cadence Design Systems, Inc.                                  
408.944.7457                                                             
holden@cadence.com                                               

Japan
Kyoko Okamoto
NEC Electronics Corporation
+ 81.44.435.1676
kyoko.okamoto@necel.com


Cadence, the Cadence logo, and Encounter are registered trademarks of Cadence Design Systems, Inc. in the United States and other countries. NEC Electronics is a registered trademark or trademark of NEC Corporation. All other marks are property of their respective owners.