Home > About Cadence > Newsroom > Press Releases

March

02 Mar 2015 Waves MaxxVoice Technology Now Available for Cadence Tensilica HiFi Audio DSPs
 
February

26 Feb 2015 Brite Semiconductor Improves Quality of Results and Reduces Time to Market for Four SoC Designs with Cadence Digital Implementation and Signoff Tools25 Feb 2015 Hitachi Reduces Verification Turnaround Time for Mixed-Signal Chip with Cadence Virtuoso AMS Designer25 Feb 2015 Cadence Achieves First PCI Express 2.0 and PCI Express 3.0 Compliance for TSMC 16nm FinFET Plus Process24 Feb 2015 Hillcrest Labs’ Freespace Always-On Sensing Software Available on Cadence Tensilica DSP24 Feb 2015 Cadence Announces Stratus High-Level Synthesis Platform19 Feb 2015 Cadence Rolls Out 2015 CDNLive User Conferences18 Feb 2015 Media Alert: Cadence to Showcase System Design and Verification Solutions at DVCon US 201517 Feb 2015 Cadence Showcases Advanced Mobile Technologies at Mobile World Congress 201517 Feb 2015 Epson Improves GPS Watch Battery Life with Cadence Tensilica Xtensa Processor12 Feb 2015 Cadence President and Chief Executive Officer Lip-Bu Tan to Present at the Morgan Stanley Technology, Media & Telecom Conference12 Feb 2015 Media Alert: Cadence to Showcase Computational Lithography and Design for Manufacturing Solutions at SPIE 201510 Feb 2015 Cadence Elects Mark W. Adams to Board of Directors09 Feb 2015 MegaChips Utilizes Cadence Tensilica Xtensa Processor in Ultra-Low Power Internet of Things Sensor Hub IC04 Feb 2015 Cadence Reports Fourth Quarter and Fiscal Year 2014 Financial Results04 Feb 2015 M31 Technology Adopts Cadence Verification IP to Achieve 2.5X Faster Verification03 Feb 2015 Cadence Offers Complete Development Environment for ARM Premium Mobile IP Suite02 Feb 2015 ARM and Cadence Provide Energy-Efficient, Comprehensive Media Components for Mobile Market
 
January

28 Jan 2015 Espressif Systems Internet of Things WiFi Chips Employ Cadence Tensilica Xtensa Low-Power Processor for Control and DSP27 Jan 2015 Cadence Expands Sigrity 2015 Technology Portfolio with New Products, a Key Feature Update and Flexible Licensing Options20 Jan 2015 UMC and Cadence Collaborate to Deliver 28nm Design Reference Flow for ARM Cortex-A7 MPCore-based SoC19 Jan 2015 DMP Adopts Cadence Palladium XP Platform to Accelerate High Performance Graphic IP Core Development13 Jan 2015 Media Alert: Cadence to Showcase Power-Aware Signal Integrity Analysis Technologies at DesignCon 201512 Jan 2015 Latest Tensilica Processors Deliver Up to 75% Memory Power and Area Savings09 Jan 2015 Cadence Announces Fourth Quarter and Fiscal Year 2014 Financial Results Webcast 06 Jan 2015 HARMAN Clari-Fi Music Restoration Technology Now Available on Cadence Tensilica HiFi Audio/Voice DSP Family06 Jan 2015 Cadence Announces Fourth Generation Tensilica HiFi DSP Architecture