MEDIA ALERT: Cadence to Present, Showcase Advanced FinFET Design Technology at Common Platform Technology Forum 2013SANTA CLARA, Calif., 04 Feb 2013
Cadence will showcase its joint development of advanced design technologies in partnership with the Common Platform Alliance (Samsung Electronics, IBM, and GLOBALFOUNDRIES) at the Common Platform Technology Forum on Feb. 5. Attendees can learn more about 20-nanometer and 14-nanometer FinFET standard cell and IP design, physical implementation, and extraction, timing and power signoff, as well as recent 14-nanometer tapeouts in which Cadence was involved.
In addition, Dr. Vassilios Gerousis, distinguished engineer and technologist at Cadence Design Systems (NASDAQ: CDNS), will join engineers from IBM Research to present: “Next-Generation R&D and Advanced Tools for 14-nanometers and Beyond.” Gerousis will be joined by Dr. Mukesh Khare, director of Semiconductor Technology Research, and Dr. Supratik Guha, director of the Physical Sciences Department.
More information is available on the Cadence Web site
- Cadence will be at Booth #401 in the Pavilion at the Santa Clara Convention Center
- Gerousis’ presentation will be in the Mission City Ballroom
- The Cadence booth will be open Feb. 5 from 11:30 a.m. to 6 p.m.
- The presentation will be Feb. 5 from 3:50 p.m. to 4:50 p.m.
About CadenceFor more information, please contact:
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com