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Cadence Award-Winning Services Open Doors to New Markets

Rockwell Collins, a leading provider of innovative communication and aviation electronics solutions, recently honored Cadence with the 2007 Subcontracts Commodity Supplier of the Year Award. Selected from among hundreds of suppliers working with Rockwell Collins, the Cadence Services organization received the award based on excellent quality, delivery, total cost of ownership, lead time, and customer service.

The award is a significant testament by Rockwell Collins to our value in their effort to deliver on-time and quality products to their customers.Jim Nimmer,Cadence Account ExecutiveCadence Design Systems, Inc.

Over the past four years, Cadence has collaborated with Rockwell Collins to provide physical design, analog design, netlist-to-GDSII implementation of SoC chips and macro blocks, and technical consulting on process options and IP selection for the competitive aerospace market. As advanced low-power design techniques have become a significant area of investment and expertise for the Cadence Services organization, the strategic partnership with Rockwell Collins has allowed their design centers to optimize and enhance their design flows, showcasing the differentiated low-power technology Cadence offers.

"Rockwell Collins requested support from Cadence as they transitioned strategic projects to a customer-owned tooling flow," said Kathy Gambino, Cadence Services Account Manager. "We helped Rockwell Collins implement low-power design strategies and enabled them to target 130nm and 90nm process nodes. They are a great customer to support; they have smart people, and value highly what our Services team can do for them—meeting aggressive project schedules while delivering high-quality products."

Cadence was also a finalist in the Semiconductor Solution category at the recent IBM Beacon Awards, recognized for design and layout services for an RF mixed-mode IC device supporting mobile phone applications. Award criteria included a long history of successful design engagements utilizing IBM technology. The RF device is the latest of many analog/RF engagements where Cadence optimized the IBM silicon offering for the benefit of a third-party customer.

Cadence has also worked with IBM in support of aerospace customers targeting IBM solutions. The two companies created a 90nm RTL-to-GDSII Reference Flow, which uses a wire-centric methodology to address key SoC development issues such as low-power design, signal integrity, test, and quality of silicon. Engagements in the near future involve going to 65nm.

"Cadence and its Services team are committed to delivering holistic solutions to our customers," said Bart Hughes, Corporate Vice President for Cadence Services. "We have a proven track record, skills, and assets in providing complementary design capabilities and offerings to assist customers with their design objectives."

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