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Multi-die Package Co-design

The consumerization of the electronics industry has led to continuously shrinking geometries and higher clock speeds to keep up with new features and increasing functionality of devices ranging from cell phones to game consoles. System design at the package and board level must now take into account much higher IO counts and complex signal interconnects.

Existing package design solutions have limitations, offering a serial, siloed, and one-way design approach with manual hand-offs across design domains. Steve Durrill and Keith Felton from Cadence Design Systems argue in Methodology and Flow Challenges in Multi-die Package Design (published in Advanced Packaging, January 2007) that this serial approach limits the efficiency of designs teams. Instead, they propose a collaborative approach that allows for concurrent design optimization across the three engineering disciplines: IC, package and PCB. This concurrent package design improves productivity and shortens the design cycle.

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