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Cadence Silicon Realization Helps Teledyne Conquer Growing ECO Challenges
Imaging leader achieves 3x gain in productivity and faster time to market during imager chip project

Teledyne Imaging Sensors (TIS) produces high-performance subsystems for space missions, long-range terrestrial surveillance, and astronomy applications. When a TIS engineering group tackled a new imager chip, it knew manual metal-only ECO changes would be too time- and cost-prohibitive to meet the project’s stringent requirements.

Cadence Encounter Conformal ECO Designer helped TIS achieve a 3x gain in productivity and accelerate time to market. With Cadence, Teledyne was able to implement pre-mask functional ECOs, eliminate time-consuming iterations through automation, and decrease the risk of missing critical bugs with independent verification technology.

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