Cadence Silicon Realization Helps Teledyne Conquer Growing ECO Challenges
Imaging leader achieves 3x gain in productivity and faster time to market during imager chip project
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Teledyne Imaging Sensors (TIS) produces high-performance subsystems for space missions, long-range terrestrial surveillance, and astronomy applications. When a TIS engineering group tackled a new imager chip, it knew manual metal-only ECO changes would be too time- and cost-prohibitive to meet the project’s stringent requirements.
Cadence Encounter Conformal ECO Designer
helped TIS achieve a 3x gain in productivity and accelerate time to market. With Cadence, Teledyne was able to implement pre-mask functional ECOs, eliminate time-consuming iterations through automation, and decrease the risk of missing critical bugs with independent verification technology. Download Cadence and Teledyne Success Story »