Key Cadence Technologies Receive Two Prestigious Awards
Cadence Virtual System Platform
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Together with the Xilinx Zynq-7000 Extensible Processing Platform, the Cadence® Virtual System Platform has been distinguished as an “Editor's Choice” product by The Journal of Embedded Signal Processing, DSP-FPGA.
Cadence and Xilinx focused a collaborative effort
on bringing a software-centric approach to embedded system development. Using the Cadence Virtual System Platform as a foundation, the two companies developed the industry’s first virtual platform that enables software engineers to perform pre-silicon system design, software development, and testing of Zynq-7000 platform-based systems. In our app-driven market, the ability to begin software development months earlier has an enormous impact on engineering productivity, schedule predictability, and project costs.
Cadence 3D-IC technology
TSMC has recognized Cadence 3D-IC technology with an “EDA Partner Award.” The award underscores Cadence R&D investment in this emerging technology, which will drive advances in IC design and packaging that enhance performance and reduce power consumption, size, and weight.
In a project involving a system on chip (SoC) and eDRAM integrated on a silicon interposer, Cadence used its 3D-IC solution employing through-silicon vias (TSVs) to help implement the interposer test vehicle. As the electronics industry moves into a new era of ultra-portable devices, 3D-ICs with TSVs will be instrumental in developing the most feature-rich handheld products with the longest battery life.
From left to right
Dr. Cliff Hou, VP Design and Technology Platform, TSMC
Samta Bansal, Sr. Product Marketing Manager, Cadence
Chi-Ping Hsu, Sr. VP of R&D, Cadence