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18 Nov 2013 VIA Telecom Finds and Fixes Problems Early with Cadence Solution12 Nov 2013 Get 10X Faster Power Signoff with New Voltus IC Power Integrity Solution

31 Oct 2013 Conversations with Lip-Bu Tan29 Oct 2013 Cadence Celebrates 25 Years15 Oct 2013 Interconnect Workbench: Your Answer to Better SoC Banwidth and Latency09 Oct 2013 Gain 10X Faster Throughput with New Spectre XPS FastSPICE Simulator08 Oct 2013 New Cadence Analog IP Family Delivers Fastest Performance at 28nm

19 Sep 2013 Cadence Support for 16nm FinFET Digital and Custom/Analog Flows and 3D-IC09 Sep 2013 Cadence Launches Palladium XP II Verification Platform and Enhanced System Development Suite06 Sep 2013 Speed Design of Ultra HD Displays with Cadence HDMI 2.0 Verification IP

15 Jul 2013 Ricoh Chooses Cadence Palladium XP Platform for Faster Development of Multifunction Printer SoCs10 Jul 2013 New Cadence Virtuoso Layout Suite for Electrically Aware Design Cuts Design Cycle 30%08 Jul 2013 TSMC Expands Collaboration with Cadence on Virtuoso Custom Design Platform

26 Jun 2013 Lower Power of Datacenters and Enterprise Apps with New Energy-Efficient Cadence PCI Express IP07 Jun 2013 STMicroelectronics Saves Two Months of Debug Time Using Cadence Incisive Debug Analyzer

29 May 2013 Cadence Design Tools Certified for TSMC 16nm FinFET Process and for TSMC 20nm Process 20 May 2013 New Cadence Tempus Signoff Solution Delivers Up to 10X Faster Timing Analysis07 May 2013 Improve Low-Power Verification Productivity By 30% with New Cadence Incisive Enterprise Simulator Release

30 Apr 2013 Cadence Delivers New Encounter Digital Implementation System for Design Success at 20nm and Below29 Apr 2013 Cadence and GLOBALFOUNDRIES Speed Design for Manufacturing Signoff at 20nm and 14nm 08 Apr 2013 Cadence and TSMC Collaborate on Advanced 16nm FinFETs04 Apr 2013 RivieraWaves Cuts Debug Cycle 30% for Low-Power IP

12 Mar 2013 Cadence to Premier Udacity MOOCs Course on Functional Hardware Verification at CDNLive Silicon Valley, March 12 07 Mar 2013 First-to-Market IP and VIP for Mobile PCI Express

19 Feb 2013 Incisive Specman/e Technology Helps Siemens Healthcare Boost Verification Productivity by 30%13 Feb 2013 Cadence, ARM, and Samsung Tapeout Industry's First Cortex-A-Based 14nm/FinFET Chip

28 Jan 2013 Cadence Introduces Virtuoso Advanced Node for Design Success at 20nm and Below24 Jan 2013 Cadence DRAM IP Paper Wins TSMC Customers' Choice Award22 Jan 2013 Double Your IP and SoC Verification Productivity with the New Incisive 12.2 Release14 Jan 2013 Palladium XP and Encounter Power System Help Texas Instruments Hit Actual Silicon at 96% Accuracy07 Jan 2013 Sharp Develops CMOS Image Sensor 2x Faster and Reaches Quality Goals with Encounter RTL-to-GDSII Flow