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Cadence Articles


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December

20 Dec 2012 Cadence, ARM, and Samsung Tapeout Industry's First Cortex-A-Based 14nm/FinFET Chip20 Dec 2012 Cadence OrCAD 16.6 is Best of EDA05 Dec 2012 Nufront Develops Mobile Computing Chip in Record Time Using Palladium XP03 Dec 2012 Deep Collaboration Drives Advanced-Node Innovation03 Dec 2012 Samsung Slashes Regression Time and Speeds Verification of SoCs Using Incisive Enterprise Simulator
 
November

21 Nov 2012 Cadence Helps Faraday Shrink ECO Implementation Time from 3 Days to 1 Hour09 Nov 2012 Spectre Accelerated Parallel Simulator Speeds Development of High-Frequency Circuits for Rohde & Schwarz07 Nov 2012 Get a Jump Start on Our Latest Products and Features With Rapid Adoption Kits
 
October

25 Oct 2012 Cadence Sets the Global Standard in VIP for AMBA-Based SoCs16 Oct 2012 Cadence and TSMC Extend Collaboration to 20nm and to Wide I/O on CoWos 15 Oct 2012 Stack Up Against Your Competition with the Cadence 3D-IC Solution
 
September

25 Sep 2012 Announcing OrCAD 16.6—A One-Two Punch for Mainstream PCB Engineers 25 Sep 2012 New Allegro 16.6 Release Accelerates Timing Closure on High-Speed PCB Interfaces by 30 to 50 Percent12 Sep 2012 Samsung Speeds SoC-Level Validation Using Cadence Accelerated Verification IP
 
August

07 Aug 2012 Cadence Releases Mixed-Signal Methodology Guide, Available Now on Lulu and coming soon on Amazon
 
July

25 Jul 2012 Cadence and STMicroelectronics Customer Success Story20 Jul 2012 IBM Relies on Cadence to Speed Distributed Teams’ Verification Management
 
June

14 Jun 2012 SiliconBlue Turns to Cadence to Tackle DFM Challenges08 Jun 2012 Cadence Pattern-Matching Technologies Accelerate Full-Chip DFM Signoff at GLOBALFOUNDRIES05 Jun 2012 Xilinx Relies on Incisive Enterprise Simulator for Swift IP Design Testing04 Jun 2012 Cadence Collaborates with Industry Leaders to Drive Advanced Node Innovation
 
May

15 May 2012 Cadence Announces New In-Circuit Acceleration Capability and Expanded Support for Accelerated VIP03 May 2012 Cadence Digital/Mixed-Signal Solution Helps Texas Instruments Achieve Verification Results 300x Faster
 
April

30 Apr 2012 TripleCheck IP Validator: A Third-Generation Solution for the Next Generation of SoC Realization13 Apr 2012 Cadence PCB Technology Wins the EFY Reader’s Choice Award for EDA Tools02 Apr 2012 Virtual System Platform Takes Home Coveted ACE Award for Software of the Year
 
March

26 Mar 2012 Driving the Cloud Revolution with Cadence VIP20 Mar 2012 Lip-Bu Tan Honored as Outstanding CEO with 2012 Singapore Business Award 14 Mar 2012 Cadence Technology Enables Low-Power Design and Implementation of Complex Kinetis SoC05 Mar 2012 Cadence Unveils its Latest Encounter RTL-to-GDSII Flow
 
January

18 Jan 2012 Cadence Receives OCP-IP Contributor of the Year Award for 201110 Jan 2012 Global Unichip and Cadence Strive for Energy Efficiency in Chip Design