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TSMC OIP Ecosystem Forum 2014

Industry Conference  
30 Sep 2014  
San Jose Convention Center, San Jose, CA  

The TSMC Open Innovation Platform® (OIP) Ecosystem Forum is a first-of-its-kind event organized by TSMC. This forum will feature a day-long, three-track technical conference along with an Ecosystem Pavilion featuring member companies.

Visit us at booth 614 at TSMC’s OIP Ecosystem Forum to learn about Cadence and TSMC’s close collaboration. At the OIP Forum, Cadence will demonstrate leveraging TSMC's Open Innovation Platform to optimize our customers’ design and manufacturing efficiency and ensure first-time product success.

In addition, explore our complete 16nm FinFET+ design solutions:
  • Digital implementation (front-end design (FED)/Encounter® Digital Implementation)
  • Physical Signoff and Verification (PVS/DFM)
  • Electrical Signoff
  • Custom/mixed-signal
  • 3D-IC
  • DDR4 16FF PHY and controller
Register, review the agenda, and read about related topics!

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