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Webinar: How to Address Your Toughest Serial Bus Design Challenges with EDA and Measurement Correlation

08 May 2014 10:00 AM (PDT)  

This webinar will teach you how to use modeling tools to correlate simulations with your physical layer measurements. The new approach discussed will enable you to confidently move from the simulation environment to the lab while consistently reducing test time!

Attend this webinar to learn more about:
  • How to effectively use modeling tools to correlate your simulations and physical layer measurements
  • Techniques for removing reflections, cross-coupling and loss in PHY measurements to allow visibility of true circuit behavior
  • Understanding issues in a complete circuit without having to build a full test board

Sarah Boen
Product Marketing Manager, Performance Oscilloscopes Tektronix

Sarah is a technical product marketing professional, specializing in high speed serial applications at Tektronix where she has held a variety of positions over the past 10 years. These have included product marketing manager and product planner, program manager, and software design engineer. She is currently focused on link analysis and USB solutions. Sarah holds an MBA and BSCS from the University of Portland.

Ken Willis
Product Engineering Director - High Speed Analysis Products, Cadence Design Systems

Ken is the Product Engineering Director of High Speed Analysis Products at Cadence Design Systems. He has 25 years of experience in modeling, analysis, design, and fabrication of high-speed digital circuits. Prior to Cadence, Ken held engineering, marketing, and management positions with Tyco, Compaq Computers, Sirocco Systems, Sycamore Networks, and Sigrity.

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