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TSMC OIP Ecosystem Forum 2013

 
Type:
Industry Conference  
Date:
01 Oct 2013  
Location:
San Jose Convention Center, San Jose, CA  

Visit us at booth 614 at TSMC’s Open Innovation Platform Ecosystem Forum to learn about Cadence and TSMC’s close collaboration. At OIP Forum, Cadence will show how we're leveraging TSMC's Open Innovation Platform to optimize our customers’ design and manufacturing efficiency and ensure first-time product success. In addition, explore our complete FinFET design enablement, advanced node IP portfolio, 3D-IC design infrastructure enablement, and foundry-qualified signoff solutions.

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Send email to events@cadence.com