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TSMC Technology Symposium 2013

Industry Conference  
23 Apr 2013  
Boston, MA  

Come to TSMC Technology Symposium to learn the latest about TSMC's advanced technologies, advanced back-end capabilities, and future development plans. Cadence, a long-time partner and close TSMC collaborator, is pleased to be a Platinum sponsor of the event.

Visit Cadence at booth #613 to learn more about:
  • PCI Express Gen3 IP solutions optimized for performance and power
  • Custom/AMS reference flow qualified for 20nm designs
  • Advanced node support with fully integrated design flows
  • Foundry-qualified signoff technologies to accelerate time to market
  • Foundation IP characterization for fast and accurate IP modeling and validation
  • 3D-IC technology support for chip-on-wafer-on-substrate (CoWos)
Cadence provides end-to-end design and development solutions for advanced nodes and high-performance cores. Join us as we showcase our leading solutions for TSMC technologies in the areas of IP, mixed signal, design for manufacturing, signoff, characterization, advanced nodes, and 3D-IC. Visit our table for demonstrations of our technologies for IP and advanced design tools.

Who should attend?
If you’re an engineer, engineering manager,or executive who wants more information on Cadence collaborations with TSMC, don’t miss TSMC Technology Symposium.

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