EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. EPEPS is jointly sponsored by the IEEE Components, Packaging and Manufacturing Technology Society and IEEE Microwave Theory and Techniques Society.
Visit Cadence at table #2, where you’ll learn more about the 16.6 release of Allegro Packaging technology including new package routing and analysis technology recently acquired from Sigrity.
Also, be sure to attend the Cadence speaking session:
Wednesday Oct 24, 8-9:30amW-I.1. An Unconditionally Stable Finite-Element Time-Domain Layered Domain Decomposition Algorithm for Simulating 3D High-Speed Circuits
Xiaolei Li, Cadence and Jian-Ming Jin, University of Illinois, Urbana-Champaign
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