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Archived Webinar: No More Wrappers – New Interface Between e and SystemC TLM 2.0

Original webinar date:
11 Sep 2012  
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Due to the ever-increasing software content of embedded systems, there is increased interest in transaction-level models. Transaction-level models (TLMs) can be used in a number of ways to speed up the design and verification effort for SoCs and their software layers. The last several years has seen strong adoption of SystemC™ TLM 2.0 for high-level modeling; it has become the de-facto standard for such models. From a verification point of view, it is important to enable a convenient mechanism to interact with high-level models from a testbench.

The new interface between e and SystemC TLM 2.0 was a result of the growing demand from our customers. The new interface improves on previous mechanisms by mirroring the SystemC TLM 2.0 sockets and thus allowing verification engineers to use the same socket mechanism from e as well. This means it is no longer required to write wrappers and map transactions – users can now transfer generic payloads directly from e to SystemC and vice versa via the standard TLM 2.0 socket mechanisms.

This webinar will introduce the basic concepts of the TLM 2.0 communication mechanisms and then show how those mechanisms are replicated in e. We will also highlight how this can be used to efficiently connect transaction-level testbenches to transaction-level models.

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