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SPIE Advanced Lithography 2012

 
Type:
Industry Conference  
Date:
12 Feb 2012 - 16 Feb 2012  
Location:
San Jose Convention Center, San Jose, CA  

SPIE Advanced Lithography is the internationally recognized forum for reporting state-of-the-art research and development in optical lithography, resists, metrology, EUV, immersion, double patterning, DFM, and imprint lithography.

Cadence provides industry-leading DFM and computational lithography solutions. Find out more and discuss your challenges with Cadence R&D experts. Contact Manoj Chacko (mchacko@cadence.com) to schedule a meeting during SPIE.

Papers
See the following technical paper presentations by Cadence experts.

Model calibration and full-mask process and proximity correction for extreme-ultraviolet lithography
Paper 8322-55 of Conference 8322
Date: Thursday, 16 February 2012

Analysis, quantification, and mitigation of electrical variability due to layout-dependent effects in SOC designs
Paper 8327-14 of Conference 8327
Date: Wednesday, 15 February 2012

Electrical design for manufacturability and layout-dependent variability hotspot detection flows at 28 nm and 20 nm
Paper 8327-40 of Conference 8327
Date: Wednesday, 15 February 2012

Self-aligned double patterning (SADP) compliant design flow
Paper 8327-5 of Conference 8327
Date: Wednesday, 15 February 2012

Free form source and mask optimization for negative-tone resist development for 22nm node contact holes
Paper 8326-31 of Conference 8326
Date: Wednesday, 15 February 2012

Analysis of layout-dependent context effects on timing and leakage in 28 nm
Paper 8327-17 of Conference 8327
Date: Wednesday, 15 February 2012

CMP effect due to perimeter: a perimeter drive dummy fill optimization approach
Paper 8327-37 of Conference 8327
Date: Wednesday, 15 February 2012

In-design hierarchical DFM closure for DFM-clean IP
Paper 8327-31 of Conference 8327
Date: Wednesday, 15 February 2012

Lithography target optimization with source-mask optimization
Paper 8326-100 of Conference 8326
Date: Wednesday, 15 February 2012

In-design process hotspot repair by pattern matching
Paper 8327-27 of Conference 8327
Date: Thursday, 16 February 2012

Who should attend?
  • Engineers interested in optical lithography, resists, metrology, EUV, immersion, double patterning, DFM, and imprint lithography

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