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Archived webinar - Should You Design Your Next System With 3D TSVs? Hear from GLOBALFOUNDRIES and Cadence

 
Type:
Webinar  
Original webinar date:
03 Sep 2010  
Location:
Online  
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Attend this webinar to discuss the challenges associated with the design, implementation, and verification of 3D-ICs using TSVs. Learn about optimum packaging solutions to meet desired performance and cost goals. Run through a holistic, production-proven flow that allows you to complete your 3D-IC design quickly.


Questions About this Event?
Send email to webinar_info@cadence.com

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