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Allegro PCB and IC Packaging Technology Road Show

 
Type:
Seminar  
Date:
03 Nov 2009 - 17 Nov 2009  
Location:
China  

What's new in Allegro® 16.2 and 16.3?
                                  

Backed by popular demand, we are pleased to announce the schedule of the Autumn 2009 Cadence® Allegro® Road Show in China, showcasing the latest 16.2 and 16.3 software. Please continue to check this registration page for future updates.

Topics

·         Allegro 16.3 new features and roadmap

·         Accelerating Design Intent Creation with Allegro System Architect

·         Meeting the Challenges of High Speed DDR3 Memory Interface Design

·         Design Data Management for PCB Design

·         RF PCB Design

·         PCB/FPGA Co-design with FPGA System Planner (FSP)

·         What’s New in IC Packaging / SiP

·         Switch-Mode Power Supply Design and Analysis with Cadence PSpice Technology

·         Cadence VCAD Service for advanced PCB and IC Packaging Design


Who should attend?

·         PCB design or layout engineers

·         IC package designers


What you will learn

The Cadence Allegro Road Show highlights how the latest Allegro technologies tackle current and emerging design challenges by providing new and enhanced capabilities to the end user. For detailed information on these business-driven technology challenges and how 16.2 helps to address them, please visit: http://www.cadence.com/cadence/newsroom/features/pages/feature.aspx?xml=allegro_orcad162.


Agenda

Shanghai, Nov 3, 2009
Shenzhen, Nov 6, 2009
Beijing, Nov 10, 2009
Other locations to be announced later


Language

Chinese and English

 

Registration

The event is by invitation only. Please contact the Cadence business manager or application engineer for your account to request a FREE registration link.


Questions About this Event?
Send email to event_cn@cadence.com