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yield,28nm

  • DAC 2012 Panelists: How to Succeed at 28nm, 20nm and 14nm

    What will it take to achieve silicon success at 28nm and below? That was the question put to a panel of experts at a Cadence-sponsored breakfast at the Design Automation Conference ( DAC 2012 ) June 6, where speakers from IBM, Cadence, ARM, Samsung, and GLOBALFOUNDRIES shed new light on business and...
    Posted to Industry Insights (Weblog) by rgoering on Tue, Jun 12 2012
  • Free DAC Breakfasts: HW/SW Co-Development, 28nm/20nm Challenges

    Don't go into the frenzied activity of the Design Automation Conference (DAC) without a good breakfast! Fortunately, you can get a good breakfast and learn a lot from two events sponsored by Cadence Tuesday, June 5 and Wednesday, June 6 at the 49 th DAC in San Francisco. Tuesday June 5 Addressing...
    Posted to Industry Insights (Weblog) by rgoering on Mon, May 14 2012
  • SPIE Papers Showcase DFM and Lithography R&D

    Ten Cadence papers planned for the upcoming SPIE Advanced Lithography conference, set for Feb. 12-16 in San Jose, California, demonstrate recent R&D developments in both "design side" design for manufacturing (DFM) and the computational lithography that takes place during the manufacturing...
    Posted to Industry Insights (Weblog) by rgoering on Thu, Jan 26 2012
  • How DRC Plus Makes DFM Easy at 28nm

    Design for manufacturability (DFM) requirements have been a barrier for many design teams who are thinking about moving to lower process nodes. But can DFM actually get easier as process nodes shrink? That possibility is offered by DRC Plus (DRC+), a new technology developed by GLOBALFOUNDRIES in collaboration...
    Posted to Industry Insights (Weblog) by rgoering on Mon, Oct 25 2010
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