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stacked die,boundary scan,JEDEC,wide i/o

  • An Update on the JEDEC Wide I/O Standard for 3D-ICs

    One of the big advantages of 3D-ICs with through-silicon vias (TSVs) is the potential for much faster memory bandwidth compared to conventional 2D ICs. That's why the emerging JEDEC wide I/O mobile DRAM memory standard, which takes full advantage of 3D die stacking to provide significant power and...
    Posted to Industry Insights (Weblog) by rgoering on Thu, Dec 15 2011
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