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stacked die,TSV,TSVs

  • 3D IC Standards – First, Let’s Define Our Terms

    There's a lot of interest in 3D ICs these days, but there are many challenges to solve before 3D IC design can move into the mainstream. One challenge is the establishment of standards for design, modeling, and manufacturability. But the starting point is likely to be something even simpler - a dictionary...
    Posted to Industry Insights (Weblog) by rgoering on Mon, May 10 2010
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