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stacked die,TSV,Deokar

  • EDA Workshop: A Reality Check On 3D ICs

    3D ICs are an attractive technology, but what will it take to make them successful? Presenters at the recent Electronic Design Processes (EDP) workshop didn't have all the answers, but they had a lot of interesting insights into how EDA tools and flows will need to change to support stacked die with...
    Posted to Industry Insights (Weblog) by rgoering on Mon, Apr 19 2010
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