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reference flow,Virtuoso

  • TSMC 3D-IC Reference Flow Supports 3D Die Stacking

    An important milestone for any new semiconductor technology is the availability of a foundry EDA reference flow. Such a milestone occurred last week (Sept. 18, 2013) as Cadence and TSMC delivered the latest Cadence 3D-IC reference flow for true 3D die stacking (right). While there has been considerable...
    Posted to Industry Insights (Weblog) by rgoering on Tue, Sep 24 2013
  • IBIS model simulation

    I am designing a Data acquisition system with a Texas instruments ADC, Inamps and a ST micro electronics micro controller. I am getting spice models for my inamps, differential amplifiers etc. so that I could do SPICE simulation. I wish to see the output of my ADC if I am providing an input signal with...
    Posted to PCB Design (Forum) by niranjan madha on Wed, Apr 17 2013
  • How to Design Analog/Mixed Signal (AMS) at 28nm

    Wireless, networking, storage, computing and FPGA applications have been moving aggressively to advanced process nodes to take advantage of lower power consumption, improved performance and area reduction. Today, most of these applications integrate a significant amount of analog/mixed signal (AMS) or...
    Posted to Mixed-Signal Design (Weblog) by nizic on Tue, Jun 21 2011
  • Problems Importing OA Design from Virtuoso into Encounter

    Hello, While trying to perform place and route using Encounter I'm "encountering" errors importing my design from Virtuoso. When I try to import the design, I get the following: Reading tech data from OA Library 'NCL' ... FE units: 0.001 microns/dbu, OA units: 0.001 microns/dbu...
    Posted to Digital Implementation (Forum) by TruLogic on Mon, Jan 10 2011
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