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power,DFT

  • Si2 DAC Panel: What Standards are Needed for 3D-ICs?

    3D-ICs with through-silicon vias (TSVs) are not yet in volume production, but work has already begun on design standards - and more work is needed soon. An excellent update on work in progress, and a discussion of what's needed, was provided at a Silicon Integration Initiative (Si2) panel discussion...
    Posted to Industry Insights (Weblog) by rgoering on Thu, Jun 28 2012
  • Don’t Blow Up Your Chip on the Tester!

    The photo at right shows a test socket and chip destroyed by thermal runaway. Can this really happen? Yes, it can and it sometimes does, if test power is significantly greater than functional power. To get a handle on this problem I talked to Bassilios Petrakis, product marketing director for Design...
    Posted to Industry Insights (Weblog) by rgoering on Mon, Mar 26 2012
  • How Logic Synthesis is Changing

    You probably haven't read much about logic synthesis lately -- it's a mature technology that doesn't attract much attention. But that doesn't mean that new and exciting things aren't happening in synthesis and front-end design, as illustrated by presentations at a Synthesis Community...
    Posted to Industry Insights (Weblog) by rgoering on Wed, Dec 14 2011
  • Three Die Stack -- A Big Step “Up” for 3D-ICs with TSVs

    A major advancement in 3D-IC through-silicon via (TSV) design will be unveiled Tuesday (Dec. 13) as representatives of CEA-LETI and ST-Ericsson describe the development of a three-die stack with wide I/O memory and logic. This tapeout is the result of a collaboration between these two organizations and...
    Posted to Industry Insights (Weblog) by rgoering on Tue, Dec 13 2011
  • Logic Design and Test Design: Do they need each other?

    Cadence has moved from traditional methods and product offerings for silicon test in favor of a new direction, which answers the title question. In 2008, Cadence recognized that while the Encounter Test product had outstanding quality of results, ease-of-use was lacking. What was perhaps most important...
    Posted to Logic Design (Weblog) by Ed JM on Sat, Apr 17 2010
  • Friday Fun: Multi-objective optimization for your iteration problem

    Here in the U.S., in recent years we've seen all kinds of commercials on TV for prescription pharmaceuticals. Needless to say, they have to figure out how to sell something that is very intangible in most cases. This is not unlike algorithm-oriented EDA software! So we decided to have some fun and...
    Posted to Logic Design (Weblog) by Jack Erickson on Fri, Apr 16 2010
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